DA2J10100L

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DA2J10100L

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DIODE GEN PURP 80V 100MA SMINI2

  • FabricanteSemiconductor de Rohm

  • Peça do Fabricante #DA2J10100L

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Especificações

Atributo Valor
Package Cut Tape (CT)
ProductStatus Obsolete

Visão Geral

Equivalent

The DA2J10100L is a dual AND gate IC. Equivalent products include:
- SN74LVC2G08 (Texas Instruments)
- MC74VHC1G08 (ON Semiconductor)
- 74LVC2G08 (NXP)
- NC7SZ08 (Fairchild/ON Semi)
These are similar dual 2-input AND gates with comparable logic functions, though voltage levels and packaging may vary. Verify pin compatibility and specs before substitution.

Pinout

The DA2J10100L is a 10-pin dual operational amplifier (op-amp) IC.
Key Functions:
- Contains two independent op-amps in a single package.
- Designed for low noise, low distortion, and high-speed signal amplification.
- Common applications include audio processing, filters, and precision analog circuits.
Pin Configuration (Typical):
1. Output A
2. Inverting Input A
3. Non-Inverting Input A
4. V- (Negative Supply)
5. Non-Inverting Input B
6. Inverting Input B
7. Output B
8. V+ (Positive Supply)
9. NC (No Connection)
10. NC (No Connection)
(Exact pinout may vary; refer to the datasheet for specifics.)
Package: Typically SOIC-10 or similar.

Manufacturer

The DA2J10100L is a diode manufactured by Diodes Incorporated, a global semiconductor company specializing in high-quality discrete, analog, and mixed-signal ICs. Founded in 1959 and headquartered in Plano, Texas, Diodes Inc. serves industries like automotive, consumer electronics, computing, and communications. The company is known for its reliable, cost-effective components and holds a strong presence in the semiconductor market.
The DA2J10100L is a 100V, 2A Schottky barrier diode, designed for high-efficiency rectification in power applications. Diodes Inc. emphasizes innovation and energy efficiency in its product lineup.

Package

The DA2J10100L is a SMD (Surface Mount Device) package, specifically a DFN (Dual Flat No-lead) type. It features a compact, leadless design with exposed pads for efficient heat dissipation, commonly used in high-density PCB applications. The package dimensions are typically small, making it suitable for space-constrained designs. Exact specs (e.g., size, pin count) should be verified in the datasheet.

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