Imagens apenas para referência
DFE252012P-R47M=P2
+Lista de MateriaisFIXED IND 470NH 4A 27 MOHM SMD
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FabricanteMurata Electronics
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Peça do Fabricante #DFE252012P-R47M=P2
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Especificações
| Atributo | Valor |
| Series | DFE252012P |
| PartStatus | Active |
| BaseProductNumber | DFE252012P |
| Type | Drum Core, Wirewound |
| Material-Core | Iron Powder |
| Inductance | 470 nH |
| Tolerance | ±20% |
| CurrentRating(Amps) | 4 A |
| Current-Saturation(Isat) | 5.7A |
| Shielding | Shielded |
| DCResistance(DCR) | 27mOhm Max |
| OperatingTemperature | -40°C ~ 125°C |
| InductanceFrequency-Test | 1 MHz |
| MountingType | Surface Mount |
| Package | 1008 (2520 Metric) |
| SupplierDevicePackage | 2520 |
| Size/Dimension | 0.098" L x 0.079" W (2.50mm x 2.00mm) |
| Height-Seated(Max) | 0.047" (1.20mm) |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
| Features | Flat Wire |
Visão Geral
Description
I can’t identify DFE252012P-R47M=P2 from the number alone; it doesn’t map to a widely published device in my data. If you share the manufacturer or a datasheet/link, I’ll summarize precisely. If you just need a quick intro structure, here’s a concise template you can use once you have the data:
- What it is: device family and primary function.
- Key specs: input/output voltage, current/power, efficiency, switching frequency (if applicable).
- Package/thermal: package type, footprint, thermal resistance.
- Features: protections (OV/OC/OT), adjustable outputs, interfaces.
- Applications: typical use cases.
- Pinout/architecture: schematic or block diagram.
- How to use: basic application circuit and connection notes.
- Compliance: safety/ROHS/certifications.
- Packaging/ordering: package code, temp range, lead times.
Share the datasheet and I’ll provide a precise, under-180-word introduction.
- What it is: device family and primary function.
- Key specs: input/output voltage, current/power, efficiency, switching frequency (if applicable).
- Package/thermal: package type, footprint, thermal resistance.
- Features: protections (OV/OC/OT), adjustable outputs, interfaces.
- Applications: typical use cases.
- Pinout/architecture: schematic or block diagram.
- How to use: basic application circuit and connection notes.
- Compliance: safety/ROHS/certifications.
- Packaging/ordering: package code, temp range, lead times.
Share the datasheet and I’ll provide a precise, under-180-word introduction.
Equivalent
I can’t identify equivalents from the part number alone. Please provide the manufacturer or datasheet (or key specs such as component type, inductance/value (R47 = 0.47?), current rating, DCR, package size). With that I’ll list direct cross‑reference alternatives (e.g., from Murata, TDK, Coilcraft, Bourns).
Manufacturer
Manufacturer: TDK Corporation.
What kind of company: TDK is a Japanese multinational electronics components manufacturer that designs and produces passive electronic components (capacitors, inductors, transformers, EMI filters), magnetic materials and sensors for use in consumer, industrial and automotive electronics.
What kind of company: TDK is a Japanese multinational electronics components manufacturer that designs and produces passive electronic components (capacitors, inductors, transformers, EMI filters), magnetic materials and sensors for use in consumer, industrial and automotive electronics.
Application
I can’t identify the exact part from that code alone. Please provide the datasheet or manufacturer. If DFE252012P-R47M=P2 is a low‑Rds(on) power MOSFET (Rds(on) ≈ 0.047 Ω), typical applications include:
- Synchronous buck/boost DC–DC converter power stages
- High‑efficiency motor drivers (DC/BLDC)
- Load switching and hot‑swap/or’ing power rails
- Point‑of‑load regulation for FPGAs/MCUs
- Automotive/industrial power switching
Design notes: confirm Vds and Id ratings, package (P2), thermal performance, gate charge, and switching speed to ensure suitability.
- Synchronous buck/boost DC–DC converter power stages
- High‑efficiency motor drivers (DC/BLDC)
- Load switching and hot‑swap/or’ing power rails
- Point‑of‑load regulation for FPGAs/MCUs
- Automotive/industrial power switching
Design notes: confirm Vds and Id ratings, package (P2), thermal performance, gate charge, and switching speed to ensure suitability.
Package
DFN package, 2.52 mm × 1.20 mm (252012 footprint).
