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EG4X20BG256I8
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Especificações
| Atributo | Valor |
| Manufacturer | Anlogic |
| Package / Case | FTBGA-256_17X17mm |
Visão Geral
Description
The EG4X20BG256I8 is a high-performance FPGA (Field-Programmable Gate Array) from Efinix, part of their Trion series. Key features include:
- 20K logic elements for flexible digital design.
- 256-pin BGA package (I8 speed grade).
- Low-power architecture with 4x4 nm process technology.
- Supports PCIe, DDR3/4, MIPI, and LVDS interfaces.
- Ideal for edge AI, IoT, and embedded applications.
It offers fast configuration, high I/O density, and cost efficiency, making it suitable for compact, power-sensitive designs.
For detailed specs, refer to Efinix’s datasheet.
- 20K logic elements for flexible digital design.
- 256-pin BGA package (I8 speed grade).
- Low-power architecture with 4x4 nm process technology.
- Supports PCIe, DDR3/4, MIPI, and LVDS interfaces.
- Ideal for edge AI, IoT, and embedded applications.
It offers fast configuration, high I/O density, and cost efficiency, making it suitable for compact, power-sensitive designs.
For detailed specs, refer to Efinix’s datasheet.
Equivalent
The EG4X20BG256I8 is a Lattice ECP5 FPGA. Equivalent products include:
- Lattice ECP5-85F (LFE5UM-85F-8BG256I)
- Lattice ECP5-25F (LFE5UM-25F-8BG256I)
- Xilinx Artix-7 (XC7A35T-1FGG256C)
- Intel (Altera) Cyclone 10 LP (10CL025YU256I8G)
These offer similar logic density, power efficiency, and package compatibility. Check datasheets for exact specs.
- Lattice ECP5-85F (LFE5UM-85F-8BG256I)
- Lattice ECP5-25F (LFE5UM-25F-8BG256I)
- Xilinx Artix-7 (XC7A35T-1FGG256C)
- Intel (Altera) Cyclone 10 LP (10CL025YU256I8G)
These offer similar logic density, power efficiency, and package compatibility. Check datasheets for exact specs.
Features
The EG4X20BG256I8 is a high-performance FPGA with the following key features:
- 256K Logic Elements: Offers robust processing capacity for complex designs.
- 20K Embedded Memory (Mb): Supports high-speed data storage and retrieval.
- BG256 Package: 256-ball BGA for compact and efficient PCB integration.
- High-Speed I/O (8Gbps+): Supports fast data transfer with advanced serial interfaces.
- Low Power Consumption: Optimized for energy-efficient applications.
- DSP Blocks: Enhanced for signal processing and arithmetic operations.
- Hardened IP Cores: Includes PCIe, DDR4, and Ethernet for streamlined development.
- Industrial-Grade (-40°C to +100°C): Reliable in harsh environments.
Ideal for networking, industrial automation, and high-performance computing.
- 256K Logic Elements: Offers robust processing capacity for complex designs.
- 20K Embedded Memory (Mb): Supports high-speed data storage and retrieval.
- BG256 Package: 256-ball BGA for compact and efficient PCB integration.
- High-Speed I/O (8Gbps+): Supports fast data transfer with advanced serial interfaces.
- Low Power Consumption: Optimized for energy-efficient applications.
- DSP Blocks: Enhanced for signal processing and arithmetic operations.
- Hardened IP Cores: Includes PCIe, DDR4, and Ethernet for streamlined development.
- Industrial-Grade (-40°C to +100°C): Reliable in harsh environments.
Ideal for networking, industrial automation, and high-performance computing.
Pinout
The EG4X20BG256I8 is a 256-pin FPGA from Efinix's Trion series. Key features include:
- Package: 256-ball BGA (17x17mm, 1.0mm pitch).
- Logic Capacity: ~20K LUTs.
- I/O Pins: ~160 user I/Os (supports 1.2V–3.3V LVCMOS).
- Functionality:
- Embedded DSP blocks.
- 1.2Mbit RAM (distributed + block RAM).
- Supports PCIe, MIPI, and DDR3 interfaces.
- Low-power (1.0V core voltage).
Designed for edge AI, IoT, and embedded applications.
- Package: 256-ball BGA (17x17mm, 1.0mm pitch).
- Logic Capacity: ~20K LUTs.
- I/O Pins: ~160 user I/Os (supports 1.2V–3.3V LVCMOS).
- Functionality:
- Embedded DSP blocks.
- 1.2Mbit RAM (distributed + block RAM).
- Supports PCIe, MIPI, and DDR3 interfaces.
- Low-power (1.0V core voltage).
Designed for edge AI, IoT, and embedded applications.
Package
The EG4X20BG256I8 is a 256-ball FineLine BGA (FBGA) package. It features a 17mm x 17mm body size with a 1.0mm ball pitch, commonly used for high-density, high-performance applications like FPGAs. The "I8" suffix indicates industrial-grade temperature range (-40°C to +100°C). This package ensures reliable thermal and electrical performance for embedded systems.
