Imagens apenas para referência
EP3C10M164C8N
+Lista de MateriaisIC FPGA 106 I/O 164MBGA
-
FabricanteIntel
-
Peça do Fabricante #EP3C10M164C8N
-
Pacote BGA-164
-
Em Estoque3718
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 645 |
| NumberofLogicElements/Cells | 10320 |
| TotalRAMBits | 423936 |
| NumberofI/O | 106 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 164-TFBGA |
Visão Geral
Description
Key features of the EP3C10M164C8N include:
1. Logic Elements: It contains around 10,320 logic elements, allowing for complex logic design and customization.
2. I/O Pins: The FPGA provides 164 I/O pins for interfacing with other components and systems.
3. Memory: It integrates embedded memory blocks for efficient data storage and retrieval during operation.
4. Power Efficiency: Designed for low power consumption, making it suitable for portable and power-sensitive applications.
5. Package: The device comes in a compact 164-pin Micro FineLine BGA package, supporting high-density designs.
These attributes make the EP3C10M164C8N a versatile choice for developers aiming to implement custom logic solutions while managing power and cost constraints effectively.
Equivalent
1. Xilinx Spartan-3 series (e.g., XC3S100E)
2. Lattice MachXO series
3. Microsemi SmartFusion series
These alternatives depend on criteria like logic elements, package type, and I/O pins. Always verify specific requirements and performance characteristics for compatibility in your application.
Features
1. Logic Elements (LEs): 10,320 LEs, which are the basic building blocks for digital logic circuits.
2. Memory: 432 Kbits of embedded memory to support various applications needing storage.
3. Phase-Locked Loops (PLLs): 2 PLLs for clock management and to support a variety of frequency synthesis.
4. I/O Pins: 179 user I/O pins, providing the flexibility for different interface requirements.
5. Operating Voltage: Core voltage of 1.2V, with I/O support for 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V standards.
6. Package: It is available in a 164-pin Micro FineLine BGA (Ball Grid Array) package, which provides a compact form factor.
7. Features: Low-power consumption and cost-effective solution ideal for high-volume applications such as consumer electronics and communications.
These features make the EP3C10M164C8N suitable for diverse applications that require a balance of performance, power efficiency, and cost-effectiveness.
Pinout
1. Logic Elements (LEs): It contains 10,320 LEs.
2. Embedded Memory: It includes 414 Kbits of embedded memory.
3. Phase-Locked Loops (PLLs): It has 2 PLLs for clock management.
4. I/O Pins: The FPGA supports a maximum of 92 user I/O pins.
5. Operating Voltage: Core voltage of 1.2V, with I/O banks supporting 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V standards.
The functions of the pins on the EP3C10M164C8N include general-purpose I/O, dedicated clock inputs, power and ground pins, configuration pins, and dedicated programming pins. The specific function of each pin is determined by the configuration and design defined by the user during the FPGA programming process. For detailed pin descriptions and configurations, referring to the official Altera (now Intel) documentation is recommended.
Manufacturer
Application
1. Consumer Electronics: Enhancing multimedia and display features.
2. Automotive Systems: Used in infotainment and advanced driver-assistance systems.
3. Industrial Automation: Provides control and processing capabilities for machinery and robotics.
4. Communications: Facilitates data processing and handling in telecommunication devices.
5. Medical Devices: Supports imaging and diagnostic equipment.
6. Test and Measurement: Used in equipment requiring real-time data processing.
Its flexibility and cost-effectiveness make it suitable for various embedded systems requiring customizable hardware solutions.