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EP3C25F256I7
+Lista de MateriaisIC FPGA 156 I/O 256FBGA
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FabricanteIntel
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Peça do Fabricante #EP3C25F256I7
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Pacote FBGA-256
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Em Estoque7006
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Cyclone® III |
| Part Status | Active |
| Number of LABs/CLBs | 1539 |
| Number of Logic Elements/Cells | 24624 |
| Total RAM Bits | 608256 |
| Number of I/O | 156 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features of the EP3C25F256I7 include:
1. Logic Elements: It contains 24,624 logic elements, making it suitable for moderate complexity designs.
2. I/O Pins: The chip offers 156 available I/O pins, providing flexibility for interfacing with various peripherals.
3. Memory: It includes embedded memory blocks, totaling approximately 608 Kbits, for efficient data handling and processing.
4. Package: It is housed in a 256-pin FineLine BGA (Ball Grid Array) package, which offers a compact footprint.
5. Temperature Range: The ‘I7’ suffix indicates it is rated for industrial temperature ranges, from -40°C to 100°C, making it suitable for harsh environments.
The EP3C25F256I7 is ideal for applications in communications, automotive, and consumer electronics, where cost-effective and reliable FPGA solutions are required.
Equivalent
Features
1. Logic Elements: It contains 24,624 logic elements, suitable for implementing complex digital circuits.
2. Embedded Memory: The FPGA has 594 Kbits of embedded memory, providing storage for data and instructions.
3. I/O Pins: It offers 182 user I/O pins, providing flexibility for connecting with various peripherals and external devices.
4. Phase-Locked Loops (PLLs): There are 4 PLLs for clock management, useful in applications requiring precise timing and synchronization.
5. Package: It comes in a 256-pin FineLine BGA package, which is compact and supports high-density designs.
6. Operating Temperature: The "I7" designation indicates an industrial temperature range, making it suitable for applications in harsh environments.
7. Low Power Consumption: Designed for low power applications, it supports efficient energy use without compromising performance.
8. Cost-Effectiveness: The Cyclone III family is known for being cost-effective, offering a balance between performance and price.
These features make it ideal for a variety of applications, including consumer electronics, industrial automation, and telecommunications.
Pinout
Manufacturer
This particular product, the EP3C25F256I7, is part of Intel's Cyclone III FPGA family. FPGAs, or Field-Programmable Gate Arrays, are integrated circuits that can be programmed by the customer or designer after manufacturing. They are used in a wide range of applications, from consumer electronics to telecommunications and industrial automation.
Intel's acquisition of Altera in 2015 allowed the company to expand its product offerings and bolster its capabilities in the programmable solutions sector, making Intel a significant player in the FPGA market. FPGAs are valued for their flexibility and adaptability, which are key in developing custom computing solutions and accelerating various computational tasks in industries such as data centers, automotive, and IoT (Internet of Things).
Application
1. Embedded Systems: Ideal for custom processing tasks and interfaces.
2. Communications: Used in protocol processing and networking equipment.
3. Industrial Automation: Suitable for control systems and robotics.
4. Consumer Electronics: Applied in signal processing and video processing.
5. Automotive: Used in infotainment systems and driver assistance features.
6. Medical Devices: Implemented in diagnostic and monitoring equipment.
These applications benefit from the FPGA’s flexible architecture and cost-effectiveness.