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EP3C25F324C8N
+Lista de MateriaisIC FPGA 215 I/O 324FBGA
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FabricanteIntel
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Peça do Fabricante #EP3C25F324C8N
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Pacote FBGA-324
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1539 |
| NumberofLogicElements/Cells | 24624 |
| TotalRAMBits | 608256 |
| NumberofI/O | 215 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 324-BGA |
Visão Geral
Description
Key specifications include 594 embedded multipliers, which are crucial for digital signal processing tasks, and 594 Kbits of on-chip RAM, which support complex data operations and storage needs. The Cyclone III family is known for its low power consumption, making it suitable for power-sensitive applications. Additionally, the EP3C25F324C8N supports various I/O standards and features multiple PLLs (Phase-Locked Loops) for clock management, enhancing its flexibility and performance in diverse applications. This FPGA is programmed via a JTAG interface and is compatible with Intel's Quartus Prime software for design and development.
Equivalent
Features
1. Logic Elements: It contains 24,624 logic elements, providing flexibility for complex designs.
2. Memory: Offers 594 Kbits of embedded memory for data storage.
3. I/O Pins: Supports up to 295 general-purpose I/O pins, adaptable for various interfaces.
4. PLL: Includes 4 phase-locked loops (PLLs) for clock management and signal synchronization.
5. Power: Designed for low power consumption, ideal for battery-powered applications.
6. Packaging: Comes in a 324-pin FineLine BGA package, ensuring compact and efficient board layout.
7. Speed Grade: The speed grade is 8, indicating moderate operational speed suitable for general applications.
These specifications make the EP3C25F324C8N suitable for applications requiring a balanced combination of logic density, power efficiency, and I/O flexibility. It's used in various fields including communications, consumer electronics, and industrial automation.
Pinout
Key functions of the EP3C25F324C8N include:
1. Logic Cells: It contains 24,624 logic elements, which are used for implementing custom digital circuits.
2. Memory: The device includes embedded memory blocks for efficient data storage and retrieval.
3. I/O Pins: It offers multiple general-purpose I/O pins that can be configured for different electrical standards.
4. PLL: The device has phase-locked loops (PLLs) for clock management, allowing for precise control of the timing.
5. Embedded Multipliers: These are optimized for implementing arithmetic functions, making the device suitable for DSP applications.
The EP3C25F324C8N is ideal for applications requiring a balance of performance, flexibility, and cost-effectiveness.
Manufacturer
Intel Corporation is a multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest and highest valued semiconductor chip manufacturers. Known primarily for its processors and semiconductor chips, Intel's product lineup also includes integrated circuits, graphics chips, and solutions for various computing and communications industries. The company plays a significant role in the technology and electronics sectors, driving advancements in computing power and innovation.
Application
1. Embedded Processing: Utilized in control systems and consumer electronics for efficient data processing.
2. Signal Processing: Employed in DSP applications, including audio and image processing.
3. Communications: Used in networking equipment for data routing, multiplexing, and protocol management.
4. Industrial Automation: Supports programmable logic for robotics and machinery control.
5. Automotive Systems: Applied in infotainment and driver assistance systems.
6. Prototyping and Development: Common in educational and research environments for FPGA-based design learning and experimentation.