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EP3C40F780C8N
+Lista de MateriaisIC FPGA 535 I/O 780FBGA
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FabricanteIntel
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Peça do Fabricante #EP3C40F780C8N
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Pacote FBGA-780
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Em Estoque3550
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Cyclone® III |
| Part Status | Active |
| Number of LABs/CLBs | 2475 |
| Number of Logic Elements/Cells | 39600 |
| Total RAM Bits | 1161216 |
| Number of I/O | 535 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
- Logic Elements: 39,600 (40K LEs)
- Memory: 1.1 Mb embedded RAM
- DSP Blocks: 35 (18x18 multipliers)
- I/O Pins: 535 (supports LVDS, PCI, and other standards)
- Package: 780-pin FineLine BGA (FBGA)
- Speed Grade: C8 (moderate performance)
- Power: Low-power 65nm process
It’s suited for cost-sensitive, mid-range applications like industrial control, communications, and embedded systems. Offers a balance of logic density, power efficiency, and I/O flexibility.
For detailed specs, refer to Intel’s Cyclone III handbook.
Equivalent
- EP3C40F780I7N (Industrial temp range)
- EP3C40F780C7N (Faster speed grade)
- EP3C40F780C6N (Even faster speed grade)
- Lattice ECP3 or Xilinx Spartan-6 (Competitor FPGAs with similar logic capacity).
Check pin compatibility and features for direct replacements.
Pinout
- Pin Count: 780 pins (FPGA package)
- Function: It features 39,600 logic elements (LEs), 1,161 Kbits of embedded memory, and 288 18x18 multipliers. It supports various I/O standards (LVTTL, LVCMOS, LVDS, etc.), with dedicated clock management (PLLs) and general-purpose I/Os for versatile digital design applications.
This FPGA is commonly used in embedded systems, industrial control, and communications due to its balance of logic density and power efficiency.
Application
- Embedded Systems: Used in control and interface logic.
- Communications: Signal processing and protocol handling.
- Industrial Automation: Motor control and sensor interfacing.
- Consumer Electronics: Video processing and display control.
- Medical Devices: Data acquisition and processing.
- Automotive: Infotainment and driver assistance systems.
It offers low power consumption, moderate logic capacity (~40K LEs), and flexible I/O, making it suitable for cost-sensitive, mid-complexity designs.