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EP4CE15F23I8LN
+Lista de MateriaisIC FPGA 343 I/O 484FBGA
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FabricanteIntel
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Peça do Fabricante #EP4CE15F23I8LN
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Pacote FBGA-484
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Cyclone® IV E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 963 |
| NumberofLogicElements/Cells | 15408 |
| TotalRAMBits | 516096 |
| NumberofI/O | 343 |
| Voltage-Supply | 0.97V ~ 1.03V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BGA |
Visão Geral
Description
Key features of the EP4CE15F23I8LN include:
- It contains 15,408 logic elements.
- The device is equipped with up to 504 Kbits of embedded memory.
- It supports various I/O standards, providing flexibility for interfacing with other components.
- The package type is FBGA, specifically with 256 pins, which offers a balance between size and pin count.
- These FPGAs support configuration via protocols like JTAG, AS, and PS, enabling easy reprogramming and updates.
The device's architecture allows for efficient implementation of complex digital circuits, facilitating rapid prototyping and deployment. Its cost-effectiveness, coupled with power efficiency, makes it a popular choice for developers working on innovative and scalable hardware solutions.
Equivalent
1. Xilinx Spartan-6 XC6SLX16, which is a similar low-cost FPGA.
2. Lattice Semiconductor's iCE40 LP/HX series, which offer low power and size advantages.
3. Microsemi's (now Microchip) IGLOO series, known for low power consumption.
Each alternative varies in terms of specific features like I/O count, logic elements, and power consumption, so selection depends on the specific application's requirements.
Features
1. Logic Elements: It contains 15,408 logic elements, providing a balance of performance and power efficiency.
2. Memory: Integrated memory includes 516 Kbits of embedded memory.
3. DSP Blocks: Comes with 112 embedded multipliers, useful for digital signal processing applications.
4. I/O Pins: Offers 179 general-purpose I/O pins for flexible connectivity.
5. Voltage: Operates at a core voltage of 1.2V with I/O support for several standards.
6. Package: Available in a 484-pin FineLine BGA package, suitable for compact designs.
7. Temperature Range: Rated for an industrial temperature range of -40°C to 100°C.
8. Configurable I/O Standards: Supports multiple I/O standards including LVDS, LVCMOS, and more.
9. PLL: Contains 4 phase-locked loops to support various clocking requirements.
This FPGA is designed for cost-sensitive, high-volume applications, balancing performance with low power consumption.
Pinout
Key functionalities of this FPGA include:
1. Logic Elements: It contains 15,408 logic elements (LEs) providing flexible logic implementation.
2. Memory: It features embedded memory blocks for on-chip data storage and processing.
3. Phase-Locked Loops (PLLs): It includes multiple PLLs for clock management and signal synchronization.
4. I/O Pins: It supports a variety of I/O standards, offering flexible interfacing options.
5. Embedded Multipliers: It is equipped with embedded multiplier blocks for efficient arithmetic operations, essential for DSP applications.
6. Low Power: The design prioritizes low power consumption, suitable for energy-sensitive applications.
Due to its package and pin count, it provides ample connectivity and functionality, making it suitable for a diverse range of applications such as communications, automotive, and industrial systems.