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EP4CE55F29C8N
+Lista de MateriaisIC FPGA 374 I/O 780FBGA
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Peça do Fabricante #EP4CE55F29C8N
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Especificações
| Atributo | Valor |
| Series | Cyclone® IV E |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 55856 |
| Total RAM Bits | 2396160 |
| Number of I/O | 374 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 780-BGA |
| Supplier Device Package | 780-FBGA (29x29) |
| Base Product Number | EP4CE55 |
| Number of LA Bs / CL Bs | 3491 |
Visão Geral
Description
The EP4CE55F29C8N features 55,880 logic elements and 2.7 Mbits of embedded memory, providing ample resources for complex digital designs. It includes various I/O options with support for high-speed transceivers, allowing it to interface with different types of peripheral devices. The device is manufactured using a 60 nm process, contributing to its lower power consumption and compact design.
It supports a range of development tools, such as the Quartus Prime Design Software, which facilitates the design, simulation, and implementation of FPGA projects. With its robust architecture and flexibility, the EP4CE55F29C8N is ideal for designers looking to implement intricate digital systems in a cost-effective and efficient manner.
Equivalent
1. Xilinx Spartan-6 series, such as the XC6SLX45.
2. Lattice ECP3 series, such as the LFE3-70EA.
3. Microsemi (formerly Actel) SmartFusion2 series, such as the M2S050.
These equivalents vary in features and specifications but target similar applications in cost-sensitive, low-power FPGA markets. Always verify compatibility with your specific use case requirements.
Features
1. Logic Elements: It contains 55,880 logic elements, providing substantial capacity for complex designs.
2. Memory: Equipped with 2,396 Kbits of embedded memory blocks, allowing for efficient data storage and retrieval.
3. I/O Pins: Offers 328 user I/O pins, facilitating extensive connectivity options for various applications.
4. Phase-Locked Loops (PLLs): Includes 4 PLLs for advanced clock management and signal synchronization.
5. DSP Blocks: Contains 156 embedded multipliers, making it suitable for digital signal processing tasks.
6. Package: Comes in a 780-pin FineLine BGA package, enabling a compact and efficient footprint.
7. Operating Conditions: Supports an operational temperature range of 0°C to 85°C, suitable for commercial applications.
8. Voltage: Operates at a core voltage of 1.2V, contributing to its low power profile.
These features make it ideal for a wide range of applications, including communications, automotive, and consumer electronics.
Pinout
Key features include:
- Pin Count: 780 pins.
- Logic Elements: 55,880 LEs.
- Embedded Memory: 2.5 Mbits.
- Phase-Locked Loops (PLLs): 4.
- I/O Pins: 383 maximum user I/O pins in the package.
- Operating Voltage: Typically 1.2 V for the core.
The pins are used for various functions including power supply, configuration, general-purpose I/Os, differential I/Os, clock inputs, and more. Specific pin functions depend on the configuration and application design. This versatility allows it to be used in diverse applications, primarily where cost-effectiveness and low power are critical.