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EP4CE6F17C7N
+Lista de MateriaisIC FPGA 179 I/O 256FBGA
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FabricanteIntel
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Peça do Fabricante #EP4CE6F17C7N
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Pacote FBGA-256
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Cyclone® IV E |
| Part Status | Active |
| Number of LABs/CLBs | 392 |
| Number of Logic Elements/Cells | 6272 |
| Total RAM Bits | 276480 |
| Number of I/O | 179 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
With its flexible architecture, the EP4CE6F17C7N supports a range of high-speed interfaces and protocols, making it suitable for data processing tasks. It includes features like PLLs for clock management, built-in memory blocks, and digital signal processing capabilities. The device is housed in a 256-pin FineLine BGA (Ball Grid Array) package, providing a compact footprint for space-constrained designs.
Development and prototyping are supported through Intel's Quartus Prime design software, which facilitates design entry, synthesis, and verification. Its low power consumption and cost-effectiveness make it a popular choice for designers seeking to implement customizable and efficient digital systems.
Equivalent
1. Xilinx Spartan-6 series (e.g., XC6SLX9).
2. Lattice Semiconductor's iCE40 or ECP5 series.
3. Microsemi/Microchip’s IGLOO2 or SmartFusion2 series.
These FPGAs vary in features and specifications, so it’s important to verify compatibility based on specific design requirements such as logic elements, I/O count, and power consumption.
Features
1. Logic Elements (LEs): It has approximately 6,272 logic elements, which are the basic building blocks for creating digital circuits.
2. Embedded Memory: The device includes around 276 Kbits of embedded memory, useful for implementing RAM, ROM, or FIFO structures.
3. Embedded Multipliers: These are optimized for digital signal processing applications and enhance the performance of computational tasks.
4. I/O Pins: The chip supports a total of 179 general-purpose input/output pins, which facilitate interfacing with other components or systems.
5. Speed and Performance: It features a maximum operating frequency of up to 150 MHz, ensuring efficient processing for a variety of applications.
6. Low Power Consumption: Designed for low power operation, making it suitable for energy-sensitive applications.
7. Package: The device comes in a 256-pin FineLine BGA package, ensuring a compact form factor.
8. Compatibility: Supports various I/O standards, enhancing flexibility in design.
These features make the EP4CE6F17C7N suitable for a range of applications, from signal processing to embedded systems.
Pinout
Key features of the EP4CE6F17C7N include:
- Logic Elements (LEs): 6,272 LEs for implementing digital circuits.
- Embedded Memory: 270 Kbits of embedded memory to store data and facilitate high-speed processing.
- Phase-Locked Loops (PLLs): 2 PLLs for clock management and frequency synthesis.
- I/O Pins: Offers configurable I/O pins for various voltage standards and interfaces.
- General-Purpose I/Os: 179 GPIOs for interfacing with other hardware components.
The EP4CE6F17C7N is suitable for cost-sensitive applications requiring low power consumption and moderate logic capacity. Its BGA package aids in efficient heat dissipation and provides a compact form factor suitable for space-constrained applications.