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EP4CE75F23C8N
+Lista de MateriaisIC FPGA 292 I/O 484FBGA
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FabricanteIntel
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Peça do Fabricante #EP4CE75F23C8N
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Pacote FBGA-484
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Em Estoque4539
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Cyclone® IV E |
| Part Status | Active |
| Number of LABs/CLBs | 4713 |
| Number of Logic Elements/Cells | 75408 |
| Total RAM Bits | 2810880 |
| Number of I/O | 292 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
Key features of the EP4CE75F23C8N include:
1. Logic Elements: It comprises 75,408 logic elements, providing robust processing capabilities.
2. Package: Offered in a 484-pin FineLine BGA package, offering a compact form factor for integration.
3. Memory: It includes embedded memory blocks, facilitating efficient data processing and storage.
4. Connectivity: Supports a range of I/O standards and protocols, making it versatile for various interfacing needs.
5. Cost Efficiency: Designed to provide a cost-effective solution without compromising on performance.
These FPGAs are suitable for a wide range of applications, including consumer electronics, automotive systems, and telecommunications, where adaptable hardware solutions are essential.
Equivalent
Features
1. Logic Elements: Approximately 75,000 LEs, providing sufficient capacity for complex designs.
2. Embedded Memory: About 2,745 Kbits of embedded RAM, useful for data storage and buffering.
3. I/O Pins: Up to 292 general-purpose I/O pins, enabling extensive connectivity options.
4. Phase-Locked Loops (PLLs): 4 PLLs supporting clock management and synthesis.
5. Package: Available in a 484-pin FineLine BGA package, offering a compact footprint.
6. Power Consumption: Designed for low power operation, suitable for power-sensitive applications.
7. Operating Temperature: Supports commercial temperature ranges from 0°C to 85°C.
8. Voltage: Core voltage operation at 1.2V with I/O support ranging from 1.2V to 3.3V.
9. Integration: Supports embedded processing with Nios II soft processor compatibility.
10. Applications: Ideal for applications in consumer electronics, wireless communication, and industrial automation.
These features make the EP4CE75F23C8N suitable for a variety of mid-range FPGA applications requiring moderate complexity and performance.
Pinout
Manufacturer
Intel Corporation is a multinational company based in the United States, widely recognized as one of the leading semiconductor manufacturers in the world. It is primarily known for designing and producing microprocessors, which are essential components in computers, servers, and a myriad of electronic devices. Besides microprocessors and FPGAs, Intel also provides technologies related to cloud computing, data centers, the Internet of Things (IoT), and artificial intelligence. The company is a pivotal player in the technology industry, contributing significantly to advancements in computing power and efficiency.
Application
1. Telecommunications: For signal processing and network infrastructure.
2. Industrial Automation: In control systems and robotics.
3. Consumer Electronics: For multimedia processing in devices.
4. Automotive: Used in infotainment systems and ADAS.
5. Medical Devices: For imaging and diagnostic equipment.
6. Aerospace and Defense: Utilized in avionics and secure communication systems.
These FPGAs are favored for their balance of performance, power efficiency, and cost-effectiveness.