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EP4CGX30CF23C7N
+Lista de MateriaisIC FPGA 290 I/O 484FBGA
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FabricanteIntel
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Peça do Fabricante #EP4CGX30CF23C7N
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Pacote FBGA-484
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Em Estoque7551
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Cyclone® IV GX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1840 |
| NumberofLogicElements/Cells | 29440 |
| TotalRAMBits | 1105920 |
| NumberofI/O | 290 |
| Voltage-Supply | 1.16V ~ 1.24V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 484-BGA |
Visão Geral
Description
Key features of the EP4CGX30CF23C7N include:
1. Logic Elements (LEs): It contains 30,000 logic elements, which are the building blocks used to implement custom digital circuits.
2. Embedded Memory: The device includes a substantial amount of embedded memory (M9K blocks) to support data storage and processing.
3. I/O Resources: It offers flexible I/O options, supporting various standards for interfacing with other components in a system.
4. Power Efficiency: Designed for low power consumption, making it ideal for energy-sensitive applications.
5. Cost-Effectiveness: Provides a cost-effective solution for implementing complex logic designs without sacrificing performance.
Overall, the EP4CGX30CF23C7N is widely used for its versatility and efficiency in programmable logic applications.
Equivalent
1. Xilinx Spartan-6 series (e.g., XC6SLX25)
2. Lattice ECP3 series (e.g., LFE3-35EA)
3. Microsemi (now Microchip) SmartFusion2 series
These alternatives may differ in specific features, so it's important to compare them based on your design requirements such as logic elements, I/O count, and power consumption.
Features
1. Logic Elements: It has approximately 30,000 logic elements, suitable for various digital applications.
2. Transceivers: Equipped with 4 integrated 3.125 Gbps transceivers for high-speed serial data transmission.
3. Memory: Contains embedded memory blocks, totaling 1,161 Kbits of RAM for data storage and processing.
4. I/O Pins: Offers a flexible I/O structure with up to 150 user I/O pins, accommodating various interfacing requirements.
5. PLL: Includes 4 phase-locked loops (PLLs) for clock management and signal conditioning.
6. Power: Designed to be low-power, making it suitable for cost-sensitive and power-efficient applications.
7. Package: Available in a 484-pin FineLine BGA package, optimizing board space and layout flexibility.
These features make the EP4CGX30CF23C7N ideal for applications requiring moderate logic capacity and high-speed data communication, such as in consumer electronics, automotive, and communications equipment.
Pinout
Manufacturer
Intel Corporation is primarily recognized for its role in producing microprocessors for personal computers, servers, and other computing devices. Over the years, the company has expanded its product portfolio to include a wide range of semiconductor products, including FPGAs, memory chips, and software development solutions. FPGAs like the EP4CGX30CF23C7N are used in various applications, including telecommunications, data centers, automotive, and consumer electronics, due to their flexibility and ability to be programmed for specific tasks after manufacturing.