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EP4CGX75DF27I7N
+Lista de MateriaisIC FPGA 310 I/O 672FBGA
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FabricanteIntel
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Peça do Fabricante #EP4CGX75DF27I7N
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Pacote FBGA-672
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Cyclone® IV GX |
| Part Status | Active |
| Number of LABs/CLBs | 4620 |
| Number of Logic Elements/Cells | 73920 |
| Total RAM Bits | 4257792 |
| Number of I/O | 310 |
| Voltage - Supply | 1.16V ~ 1.24V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features of the EP4CGX75DF27I7N include:
1. Logic Elements: It contains a significant number of logic elements (LEs) to support complex designs and algorithms.
2. Transceivers: It includes integrated transceiver blocks, supporting high-speed serial data transmission.
3. Low Power Consumption: Optimized for low static and dynamic power consumption, making it suitable for energy-efficient systems.
4. Rich I/O Interfaces: Supports a wide range of I/O standards to facilitate connectivity and integration.
5. Programmability: As with all FPGAs, it can be reprogrammed to implement custom logic functions, allowing for flexible design updates and prototyping.
Overall, the EP4CGX75DF27I7N is a versatile component for developers looking to implement custom digital designs in a cost-effective, scalable solution.
Equivalent
1. Xilinx Spartan-6 series FPGAs (e.g., XC6SLX75).
2. Lattice ECP3 series FPGAs (e.g., LFE3-70E).
3. Microsemi/Microchip IGLOO2 series FPGAs (e.g., M2GL090).
These offer comparable performance, logic elements, and I/O capabilities, though specific features may vary. Always verify compatibility with your project's requirements.
Features
Key features include:
1. Logic Elements (LEs): Approximately 75,000 LEs, which are used for implementing custom logic functions.
2. Embedded Memory: Embedded memory blocks for efficient data storage and retrieval.
3. DSP Blocks: Dedicated DSP blocks for signal processing tasks, such as filtering and fast Fourier transforms.
4. I/O Pins: Multiple I/O pins support various communication standards and interfaces.
5. Transceivers: Integrated high-speed transceivers for serial data transmission.
6. Low Power Consumption: Designed for energy-efficient applications.
7. Configuration Options: Supports various configuration modes for flexibility in design.
8. Package: Available in a 27x27 mm package, facilitating integration into compact designs.
9. Development Tools: Supported by Intel’s Quartus Prime software for design and development.
These features make the EP4CGX75DF27I7N suitable for diverse applications requiring moderate logic density and high-speed connectivity.
Pinout
The EP4CGX75DF27I7N is designed to provide a balance of cost, power, and performance, ideal for a variety of applications including industrial, communication, and consumer electronics. It features resources such as embedded multipliers, PLLs, and gigabit transceivers, targeting high-speed data processing and communication tasks. The pins are used for general-purpose I/O, power supply connections, and dedicated functions like clock inputs and transceiver connections.
For exact pin functions and assignments, it is critical to refer to the specific datasheet or pin-out file provided by the manufacturer, as these assignments can vary based on user configuration and application requirements.
Manufacturer
Application
1. Telecommunications: Used in networking equipment for data processing and protocol handling.
2. Broadcast and Audio/Video Processing: Utilized in video processing, format conversion, and broadcast systems.
3. Industrial Automation: Deployed in control systems and smart sensors for real-time data processing.
4. Consumer Electronics: Implemented in high-performance audio/video devices.
5. Medical Devices: Applied in diagnostic imaging and monitoring equipment for signal processing tasks.
These applications benefit from its balance of performance, cost, and power efficiency.