Imagens apenas para referência
FDMF5822DC
+Lista de MateriaisHALF BRIDGE BASED MOSFET DRIVER
-
FabricanteSemiconductor Fairchild
-
Peça do Fabricante #FDMF5822DC
-
Ficha Técnica FDMF5822DC DataSheet
-
Pacote WFQFN-31
-
Em Estoque2672
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Package / Case | Bulk |
| Series | PowerTrench®, SyncFET™ |
| Part Status | Active |
| Output Configuration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| Load Type | Inductive |
| Technology | UMOS |
| Rds On (Typ) | 470mOhm LS, 680mOhm HS |
| Current - Output / Channel | 55A |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Load | 4.5V ~ 16V |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Features | Bootstrap Circuit, Latch Function, Status Flag |
| Fault Protection | Over Temperature, UVLO |
| Mounting Type | Surface Mount |
Visão Geral
Description
Its integrated design reduces the need for external components, thereby saving space and potentially reducing costs. Additionally, the FDMF5822DC may feature protection mechanisms like over-temperature and over-current protection, enhancing reliability and durability in various operating conditions.
Engineers choosing the FDMF5822DC benefit from its efficient thermal management and ease of integration, making it a popular choice in advanced power supply designs where both performance and compactness are critical. Always refer to the manufacturer's datasheet for specific technical details and compatibility to ensure it meets the requirements of your specific application.
Equivalent
Features
1. Integrated Design: Combines a driver IC, high-side MOSFET, and low-side MOSFET into a single package, optimizing space and reducing component count.
2. Efficiency: Offers high efficiency due to low switching and conduction losses, making it suitable for applications requiring power efficiency.
3. Thermal Performance: The package design enhances thermal performance, allowing for effective heat dissipation and potentially reducing the need for extensive cooling solutions.
4. Switching Frequency: Supports high switching frequencies, which can lead to smaller external components and overall compact designs.
5. Protection Features: Includes built-in protection mechanisms such as over-current, under-voltage lockout, and over-temperature protection to enhance system reliability.
6. Applications: Ideal for use in computing systems, servers, and high-end consumer electronics where efficient power delivery is essential.
This module is often selected for power supply solutions in advanced technological environments due to its compact design and robust feature set.
Pinout
Key functions of the FDMF5822DC include:
1. High Efficiency: Optimized for reduced switching and conduction losses.
2. Integrated Protection Features: Includes over-current protection (OCP), under-voltage lockout (UVLO), and over-temperature protection (OTP).
3. Optimized Gate Drive: Provides appropriate drive strength for the integrated MOSFETs to ensure efficient switching.
4. Smart Power Stage (SPS): Offers telemetry capabilities for monitoring voltage, current, and temperature.
This module is typically used in applications such as server and computing power supplies, graphics cards, and high-performance DC-DC converters, where space efficiency and high power density are crucial.
Manufacturer
Onsemi is recognized for its focus on providing energy-efficient solutions and is a prominent player in power management and analog devices. The company offers products like power modules, sensors, discrete devices, custom ICs, and more. Onsemi aims to help customers reduce energy consumption and meet the rising demand for efficient power usage and renewable energy applications.
Application
1. Voltage Regulation Modules (VRMs): For powering CPUs, GPUs, and other high-performance processors.
2. DC-DC Converters: In computing and telecommunications equipment.
3. Servers and Workstations: Providing efficient power delivery and thermal management.
4. Graphics Cards: Supporting high power densities and efficient thermal performance.
5. Networking Equipment: Where space and power efficiency are critical.
Its integration of drivers and MOSFETs in a single package allows for reduced component count and improved efficiency, making it suitable for compact and high-density electronic designs.