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GD25D40CTIGR
+Lista de MateriaisIC FLASH 4MBIT SPI/DUAL 8SOP
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FabricanteGigaDevice Semiconductor (HK) Limited
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Peça do Fabricante #GD25D40CTIGR
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Ficha Técnica GD25D40CTIGR DataSheet
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Especificações
| Atributo | Valor |
| Series | GD25D |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Memory Size | 4Mbit |
| Memory Organization | 512K x 8 |
| Memory Interface | SPI - Dual I/O |
| Clock Frequency | 104 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Technology | FLASH - NOR (SLC) |
| Write Cycle Time - Word, Page | 50µs, 4ms |
| Supplier Device Package | 8-SOP |
| Access Time | 6 ns |
Visão Geral
Description
Key characteristics of this chip include its robust data retention capabilities and endurance, allowing it to perform reliably over extended periods. The GD25D40CTIGR is typically used in applications such as firmware storage in consumer electronics, embedded systems, and various industrial applications. It is packaged in a compact form factor suitable for integration into a variety of circuit boards. Its temperature range and reliability make it a versatile choice for both consumer and industrial applications. Overall, the GD25D40CTIGR offers a balance of performance and durability, meeting the demands of modern electronic designs.
Equivalent
1. W25Q40EW by Winbond
2. MX25V4035F by Macronix
3. AT25SF041 by Adesto Technologies (Dialog Semiconductor)
4. EN25Q40B by Eon Silicon Solutions
5. FM25Q04 by Fudan Microelectronics
These alternatives typically feature similar capacities, voltage ranges, and package types, making them suitable substitutes depending on specific requirements.
Features
Key features include:
1. Memory Organization: 512K x 8-bit structure.
2. Low Power Consumption: Offers efficient power management, ideal for battery-operated devices.
3. Sector Erase Functionality: Allows for 4KB, 32KB, and 64KB erase operations.
4. Security: Features a write protection mechanism and a 64-bit unique ID for security purposes.
5. Endurance: Supports up to 100,000 program/erase cycles per sector.
6. Temperature Range: Operates reliably over a temperature range from -40°C to +85°C, suitable for industrial applications.
7. Package Type: Typically available in an 8-pin package, such as SOP8 (Small Outline Package).
These features make the GD25D40CTIGR suitable for use in consumer electronics, industrial applications, and other embedded systems requiring reliable non-volatile memory.
Pinout
1. CS# (Chip Select): Activates the chip for communication.
2. SO (Serial Output): Outputs data to the microcontroller.
3. WP# (Write Protect): Protects certain parts of the memory from being overwritten.
4. VSS (Ground): Ground reference for the power supply.
5. SI (Serial Input): Receives data from the microcontroller.
6. SCK (Serial Clock): Provides the clock signal for data transfer.
7. HOLD#: Pauses communications without deselecting the chip.
8. VCC (Power Supply): Provides the necessary power for the chip to operate.
These pins facilitate SPI (Serial Peripheral Interface) communication, enabling the chip to interface with a microcontroller or other digital devices.