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GD25LQ80BUIGR
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FabricanteGigaDevice
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Peça do Fabricante #GD25LQ80BUIGR
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Ficha Técnica GD25LQ80BUIGR DataSheet
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Pacote SOP-8
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Em Estoque7048
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Especificações
| Atributo | Valor |
| MinimumOperatingTemperature | - 40 C |
| MaximumOperatingTemperature | + 85 C |
| Brand | GigaDevice |
| ProductType | NOR Flash |
| Subcategory | Memory & Data Storage |
| MountingStyle | SMD/SMT |
| SupplyVoltage-Max | 2.1 V |
| SupplyVoltage-Min | 1.65 V |
| MemorySize | 8 Mbit |
| InterfaceType | SPI |
| ActiveReadCurrent-Max | 20 mA |
| Package/Case | SOP-8 |
| DataBusWidth | 8 bit |
| Speed | 104 MHz |
| MaximumClockFrequency | 104 MHz |
| Organisation | 1 M x 8 |
Visão Geral
Description
Key characteristics include a quad-SPI (QSPI) interface, which allows for high-speed data transfer, making it suitable for fast read and write operations. The device operates on a voltage range of 2.7V to 3.6V and supports various features such as deep power-down and hardware write protection for enhanced data security.
The GD25LQ80BUIGR is known for its reliability and low power consumption, making it an ideal choice for embedded systems that require efficient memory solutions. It is available in various packages, including SOP and WSON, catering to different design requirements. Overall, this flash memory chip provides a robust solution for applications needing efficient and reliable non-volatile storage.
Equivalent
Features
1. Interface: SPI (Serial Peripheral Interface) with a dual and quad I/O option for faster data transfer.
2. Speed: Supports clock frequencies up to 104 MHz, enabling high-speed data access.
3. Voltage Range: Operates on 2.7V to 3.6V, making it suitable for battery-powered applications.
4. Endurance: Typically supports 100,000 program/erase cycles, ensuring durability over time.
5. Data Retention: Offers a data retention period of up to 20 years.
6. Package Options: Available in various packages, including SOIC-8 and WSON-8, for flexible integration.
7. Programming: Features a page programming method and supports sector and bulk erase functions.
8. Applications: Ideal for use in embedded systems, consumer electronics, automotive applications, and IoT devices.
This combination of features makes the GD25LQ80BUIGR a versatile choice for flash memory needs.
Pinout
The pin functions are as follows:
1. CS# (Chip Select): Active low; used to select the device.
2. SO (Serial Out): Data output; used to send data from the chip to the host.
3. W# (Write Enable): Enables write operations to the memory.
4. HOLD# (Hold): Pauses serial communications without resetting the device.
5. SCK (Serial Clock): Clock input for synchronizing data transfer.
6. SI (Serial In): Data input; used to send commands and data to the chip.
7. VCC: Power supply pin (typically 2.7V to 3.6V).
8. GND: Ground pin.
This device supports various functionalities, including fast read, program, and erase operations, making it suitable for a wide range of applications.
Manufacturer
Application
1. Consumer Electronics: Smartphones, tablets, and digital cameras for firmware storage.
2. Automotive: Engine control units (ECUs) and infotainment systems for data logging and software updates.
3. Industrial: Programmable logic controllers (PLCs) and automation equipment for data retention and configuration storage.
4. Networking: Routers and switches for configuration and firmware.
5. IoT Devices: Smart home products and wearables for application code and data storage.
Its versatility and reliability make it suitable for a wide range of electronic applications.