GD32F350K8U6

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GD32F350K8U6

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Especificações

Atributo Valor
Manufacturer GigaDevice Semicon Beijing
Package QFN-32-EP(5x5)
Number of I/O 27
Voltage - Supply 2.6V~3.6V
CPU Core ARM-M4
Program Memory Type FLASH
Program Storage Size 64KB
ADC (Bit) 12bit
PWM (Bit) 16bit
CPU Maximum Speed 108MHz
DAC (Bit) 12bit

Visão Geral

Description

The GD32F350K8U6 is a 32-bit ARM Cortex-M4 microcontroller by GigaDevice, featuring:
- Core: 108 MHz Cortex-M4 with FPU and DSP instructions
- Memory: 64 KB Flash, 16 KB SRAM
- Peripherals: USB 2.0 FS, 3x USART, 2x SPI, 2x I²C, 1x CAN, 12-bit ADC (10 ch), 12-bit DAC
- GPIO: Up to 39 I/O pins
- Packages: LQFP48 (7x7mm)
- Operating Range: 2.6–3.6V, -40°C to +85°C
Ideal for cost-sensitive embedded applications like consumer electronics, IoT, and industrial control. Offers enhanced performance and power efficiency compared to similar Cortex-M3/M0+ MCUs.

Pinout

The GD32F350K8U6 is a 32-bit ARM Cortex-M4 microcontroller with the following specifications:
- Pin Count: 32 pins (LQFP32 package)
- Key Functions:
- GPIO: Up to 27 general-purpose I/O pins
- Communication: USART, I2C, SPI interfaces
- Analog: 12-bit ADC (up to 10 channels)
- Timers: Advanced & general-purpose timers (PWM support)
- Debug: SWD (Serial Wire Debug) interface
- Clock: Up to 108 MHz via internal PLL
It is commonly used in embedded applications requiring low power and high performance.

Application

The GD32F350K8U6, a Cortex-M4 MCU by GigaDevice, is widely used in:
- Consumer Electronics: Smart home devices, wearables.
- Industrial Control: PLCs, motor control, automation.
- IoT: Sensor nodes, wireless modules.
- Automotive: Auxiliary systems, lighting control.
- Medical Devices: Portable monitors, diagnostic tools.
- Embedded Systems: HMI, data logging.
With its high performance, low power, and rich peripherals (USB, ADC, PWM), it suits cost-sensitive, real-time applications.

Package

The GD32F350K8U6 comes in a QFN-32 package (Quad Flat No-leads, 32 pins). It measures 5mm x 5mm with a 0.5mm pin pitch, making it compact for space-constrained designs. This package type is surface-mountable, offering good thermal and electrical performance. Suitable for applications requiring small form factors, such as IoT devices and embedded systems.

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