GD32F470IGH6

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GD32F470IGH6

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Especificações

Atributo Valor
Manufacturer GigaDevice Semicon Beijing
Package BGA-176
Number of I/O 140
CPU Core ARM-M4
Program Memory Type FLASH
Program Storage Size 1MB
ADC (Bit) 12bit
CPU Maximum Speed 240MHz
DAC (Bit) 12bit

Visão Geral

Description

The GD32F470IGH6 is a high-performance microcontroller from GigaDevice, based on the Arm Cortex-M4 core (with FPU) running at 240 MHz. It features 3MB Flash, 512KB SRAM, and supports dual-bank Flash for secure firmware updates.
Key peripherals include:
- USB 2.0 OTG (HS/FS)
- Ethernet MAC (10/100)
- CAN 2.0B
- 3x ADCs, 2x DACs
- Timers, PWM, SPI/I2C/UART
Built on 55nm process, it offers low power consumption and robust performance for industrial, IoT, and consumer applications. The IG (LQFP176) package ensures compatibility with high-pin-count designs.
Notable for its real-time control and rich connectivity, the GD32F470IGH6 is a cost-effective alternative to similar STM32 MCUs.

Equivalent

The GD32F470IGH6 is a high-performance MCU from GigaDevice. Equivalent products include:
- STM32F407/417 series (STMicroelectronics)
- AT32F403/413 series (Artery)
- APM32F407 series (Geehy)
- MM32F5270 series (MindMotion)
These alternatives offer similar Cortex-M4/M7 cores, clock speeds (~168-240MHz), and peripheral compatibility. Differences may include flash size, power efficiency, and pricing. Always verify pinout and features before substitution.

Features

The GD32F470IGH6 is a high-performance microcontroller by GigaDevice, featuring:
- Core: 240 MHz Arm Cortex-M4F with FPU and DSP instructions
- Memory: 1MB Flash, 256KB SRAM (plus 4KB backup SRAM)
- Connectivity: USB 2.0 OTG, CAN 2.0B, Ethernet (10/100M), USART, SPI, I2C
- Timers: Advanced PWM, basic/capture timers, watchdog
- Analog: 3x 12-bit ADCs (2.4 MSPS), 2x 12-bit DACs
- GPIO: Up to 114 I/Os, 5V-tolerant
- Security: CRC, AES, RNG, tamper detection
- Packaging: 176-pin LQFP
- Operating Range: 1.8V–3.6V, -40°C to +85°C
Ideal for industrial, IoT, and high-speed control applications.

Pinout

The GD32F470IGH6 is a high-performance microcontroller from GigaDevice, based on the Arm Cortex-M4 core.
- Pin Count: 176 pins (LQFP package).
- Key Functions:
- GPIO: Up to 140 general-purpose I/O pins.
- Communication: Multiple USART, SPI, I2C, CAN, and USB interfaces.
- Analog: 3x 12-bit ADCs, 2x 12-bit DACs.
- Timers: Advanced PWM, basic/capture timers.
- Memory: 1MB Flash, 256KB SRAM, supports external memory (FSMC).
- High-Speed: Supports Ethernet MAC (10/100M) and TFT-LCD interface.
It operates at up to 240 MHz and is suited for industrial, IoT, and embedded applications.

Manufacturer

The GD32F470IGH6 is manufactured by GigaDevice, a Chinese semiconductor company specializing in memory and microcontroller (MCU) products.
GigaDevice is known for its ARM Cortex-M-based GD32 MCUs, which compete with STMicroelectronics' STM32 series. The company provides cost-effective, high-performance solutions for embedded systems, IoT, and industrial applications.
Founded in 2005 and headquartered in Beijing, GigaDevice has grown into a key player in the global MCU market, leveraging its expertise in flash memory technology. The GD32F470IGH6 is part of its high-performance MCU lineup, featuring a Cortex-M4 core with DSP and FPU support.
GigaDevice is recognized for its competitive pricing, strong local support, and compatibility with industry-standard development tools, making it a popular choice in China and internationally.

Application

The GD32F470IGH6, a high-performance Arm Cortex-M4 MCU, is widely used in:
1. Industrial Control – PLCs, motor control, automation.
2. Consumer Electronics – Smart home devices, wearables.
3. IoT & Connectivity – Wireless modules, gateways.
4. Automotive – Body control, infotainment.
5. Medical Devices – Portable monitors, diagnostic tools.
6. Embedded Systems – Robotics, drones.
With high-speed processing (240 MHz), rich peripherals (USB, CAN, Ethernet), and ample memory, it suits demanding real-time applications.

Package

The GD32F470IGH6 comes in a LQFP-176 package. This is a 176-pin, low-profile quad flat package with a body size of 24×24 mm and a lead pitch of 0.5 mm. It is suitable for surface-mount applications, offering good thermal and electrical performance for high-density designs.

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