H26M64103EMR

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H26M64103EMR

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  • FabricanteJLCPCB Assembly

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Especificações

Atributo Valor
Manufacturer JLCPCB Assembly
Package / Case FBGA-153_L13.0-W11.5

Visão Geral

Description

The H26M64103EMR is a flash memory component typically used in electronic devices for data storage. It is part of the NAND flash memory family, which is known for its high-density storage capabilities and cost efficiency, making it suitable for various consumer electronics, such as smartphones, tablets, and solid-state drives (SSDs).
This particular memory chip is designed to provide a balance between performance, reliability, and power efficiency. It features multiple layers of memory cells, allowing it to store more data in the same physical space compared to older technologies. The H26M64103EMR supports various interfaces and protocols to ensure compatibility with a wide range of hardware designs.
Key characteristics of the H26M64103EMR include its non-volatile nature, meaning it retains data without power, and its ability to handle large volumes of read/write cycles, which is essential for everyday use in modern applications. Its compact form factor and robust endurance make it a favored choice for manufacturers aiming to enhance device performance while maintaining a compact and lightweight design.

Equivalent

The H26M64103EMR is a NAND Flash memory chip. For equivalent products, consider other NAND Flash memory chips with similar storage capacity and performance characteristics. Examples include:
1. Samsung K9F1G08U0C
2. Micron MT29F1G08ABAEAWP
3. Toshiba TC58NVG0S3EBAI5
4. SK Hynix H27U1G8F2CTR
Ensure compatibility with your specific application by checking datasheets for detailed specifications and pin configurations.

Features

The H26M64103EMR is a NAND Flash memory component typically used in various electronic devices for data storage. Key features of this memory chip include:
1. Type: It is a NAND Flash memory, known for its high-density storage capabilities.
2. Capacity: Offers a storage capacity of 64 Gb (Gigabits), suitable for a range of applications that require substantial data storage.
3. Voltage: Operates at a low voltage, typically around 1.8V, making it energy-efficient.
4. Interface: Supports a standard NAND interface, allowing for easy integration into various systems.
5. Package: Usually available in a standard package size, such as a BGA (Ball Grid Array), facilitating compact device design.
6. Endurance and Reliability: Designed to withstand a high number of program/erase cycles, ensuring durability and reliability over extended use.
7. Performance: Provides fast read and write speeds, contributing to the efficient operation of systems in which it is installed.
These features make the H26M64103EMR suitable for use in consumer electronics, embedded systems, and other applications requiring reliable and efficient non-volatile memory.

Manufacturer

The H26M64103EMR is a NAND flash memory product manufactured by SK Hynix. SK Hynix is a South Korean company that specializes in the production of semiconductor products, including memory chips such as DRAM and NAND flash. It is one of the leading semiconductor manufacturers in the world, providing essential components for a wide range of electronic devices, including smartphones, computers, and other digital products. SK Hynix is known for its advanced technology in memory solutions and plays a critical role in the global electronics supply chain.

Application

The H26M64103EMR is a type of NAND flash memory often used in various electronic applications. Its primary application areas include consumer electronics like smartphones, tablets, and digital cameras, where it serves as primary or secondary storage. It's also utilized in industrial automation systems and embedded systems for data storage and retrieval due to its reliability and storage capacity. Additionally, this memory chip is used in automotive electronics for infotainment systems and advanced driver-assistance systems (ADAS), as well as in networking equipment for firmware storage. Its versatility and durability make it suitable for a wide range of applications requiring efficient data storage solutions.

Package

The H26M64103EMR is typically found in a Ball Grid Array (BGA) package type. BGA is a type of surface-mount packaging used for integrated circuits, which allows for more interconnection pins than traditional packages, improving performance and reliability.

Frequently Asked Questions


Q: What is the specific package type of the H26M64103EMR?
A: It uses an FBGA-153 package with dimensions of 13.0 mm by 11.5 mm, suitable for surface mount assembly.


Q: Is this component compatible with standard JLCPCB assembly processes?
A: Yes, as a JLCPCB Assembly part, it is designed for compatibility with their pick-and-place and reflow soldering workflows.


Q: Can the H26M64103EMR be used in high-reliability industrial designs?
A: Without explicit lifecycle or RoHS data, verify current availability and compliance via JLCPCB for industrial-grade application suitability.


Q: What is the typical application for this FBGA-153 memory component?
A: It is likely a NAND flash or eMMC memory used in embedded systems, SSDs, or consumer electronics requiring compact storage.


Q: Does the FBGA-153 package require specific PCB layout precautions?
A: Yes, use a 0.8 mm pitch footprint, ensure proper via-in-pad support, and follow JLCPCB’s design rules for 153-ball arrays.


Q: Is the H26M64103EMR lead-free and RoHS compliant?
A: The RoHS status is not specified; check the latest part marking or JLCPCB’s verification tool for definitive compliance data.


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