H5TQ4G63EFR-TEC

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H5TQ4G63EFR-TEC

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4Gbit 1.425V~1.575V 1.066GHz DDR3 SDRAM FBGA-96 Memory (ICs) RoHS

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Especificações

Atributo Valor
Packaging FBGA-96
Clock Frequency 1.066GHz
Memory Format DDR3 SDRAM
Memory Size 4Gbit
Operating Temperature -40℃~+95℃
Voltage - Supply 1.425V~1.575V

Visão Geral

Features

The H5TQ4G63EFR-TEC is a 4Gb (512MB) DDR3L SDRAM chip with the following key features:
- Density & Organization: 4Gb (512M x 8)
- Voltage: Low-power 1.35V (DDR3L), compatible with 1.5V
- Speed: 1866 Mbps (DDR3L-1866)
- Timings: CL=13, tRCD=13, tRP=13
- Package: 96-ball FBGA
- Refresh: 8192 cycles/64ms
- Operating Temp: Commercial (0°C to 95°C)
- Features: On-die termination (ODT), auto-refresh, self-refresh
Ideal for low-power, high-performance applications like networking, embedded systems, and consumer electronics.

Pinout

The H5TQ4G63EFR-TEC is a 4Gb (512M x 8) DDR3L SDRAM chip from SK Hynix.
- Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- Low-voltage operation (1.35V, DDR3L-compatible).
- 8-bit prefetch architecture for high-speed data transfer.
- Clock frequency: Up to 933 MHz (1866 Mbps/pin).
- On-Die Termination (ODT) for signal integrity.
- Auto-refresh & self-refresh modes for power efficiency.
Common applications include mobile devices, embedded systems, and low-power computing.

Manufacturer

The H5TQ4G63EFR-TEC is a 4Gb DDR3 SDRAM chip manufactured by SK Hynix, a South Korean semiconductor company.
SK Hynix is a major global producer of memory chips, specializing in DRAM, NAND flash, and other semiconductor solutions. It is one of the largest memory suppliers worldwide, competing with companies like Samsung and Micron. The company supplies components for various applications, including consumer electronics, servers, and automotive systems.

Package

The H5TQ4G63EFR-TEC is a 4Gb (512Mx8) DDR3 SDRAM chip. It comes in a 96-ball FBGA (Fine-pitch Ball Grid Array) package, specifically the FBGA-96 type. This compact, surface-mount package is designed for high-density memory applications, offering reliable performance in space-constrained designs. The package dimensions are standardized for compatibility with DDR3 modules.

Frequently Asked Questions


Q: What is the memory capacity and organization of the H5TQ4G63EFR-TEC?
A: It is a 4Gbit DDR3 SDRAM, typically organized as 512M x 8-bit, suitable for high-density memory applications.


Q: What is the maximum operating clock frequency of this IC?
A: The clock frequency is 1.066GHz, corresponding to DDR3-2133 data rates, offering high-speed data transfer.


Q: What voltage supply range does this memory require?
A: It requires a VDD and VDDQ supply from 1.425V to 1.575V, compliant with standard DDR3 specifications.


Q: Is this component suitable for industrial temperature environments?
A: Yes, its operating temperature range is -40℃ to +95℃, making it suitable for industrial or extended temperature applications.


Q: What is the physical package type of the H5TQ4G63EFR-TEC?
A: It is packaged in FBGA-96 (Fine-pitch Ball Grid Array, 96 balls), a common package for high-density DDR3 ICs.


Q: Can this memory be used in networking or embedded systems?
A: Yes, with its 4Gbit capacity and high clock speed, it is ideal for routers, switches, and embedded computing modules.


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