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HD6417705F133BV
+Lista de MateriaisIC MCU 32BIT ROMLESS 208LQFP
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FabricanteRenesas Electronics America Inc.
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Peça do Fabricante #HD6417705F133BV
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Pacote LQFP-208
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | SuperH® SH7700 |
| Part Status | Last Time Buy |
| Core Processor | SH-3 |
| Core Size | 32-Bit Single-Core |
| Speed | 133MHz |
| Connectivity | EBI/EMI, FIFO, IrDA, SCI, USB |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 105 |
| Program Memory Type | ROMless |
| RAM Size | 32K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.4V ~ 1.6V |
| Data Converters | A/D 4x10b |
| Oscillator Type | Internal |
| Operating Temperature | -20°C ~ 75°C (TA) |
| Mounting Type | Surface Mount |
Visão Geral
Description
This microprocessor supports efficient execution of multimedia applications, embedded systems, and other time-critical applications by integrating various peripherals and interfaces. It typically features memory management and various connectivity options to facilitate integration into a wide array of devices, ranging from industrial equipment to consumer electronics.
The HD6417705F133BV strikes a balance between power consumption and processing capability, making it an ideal solution for applications where performance efficiency is critical. Its design supports scalability and flexibility, allowing developers to optimize it for specific use cases in embedded system environments.
Equivalent
Features
1. Architecture: Utilizes a 32-bit H8S/7700 CPU core, which is part of the H8S family known for efficient performance and low power consumption.
2. Clock Speed: Capable of operating at a frequency of 133 MHz, providing a balance between processing power and energy efficiency.
3. Memory: Supports various types of memory interfaces, including ROM, RAM, and Flash, allowing for flexible storage solutions in embedded applications.
4. Peripheral Support: Comes with integrated peripheral functions, such as timers, serial communication interfaces (SCI), and A/D converters, which are essential for controlling and managing external devices.
5. Power Management: Includes low-power modes to conserve energy, making it suitable for battery-operated devices.
6. Package: Typically available in compact surface-mount packages, facilitating easy integration into circuit boards.
7. Applications: Ideal for use in automotive, industrial automation, consumer electronics, and other embedded system applications due to its reliability and versatility.
Overall, the HD6417705F133BV is valued for its robust performance, integrated peripherals, and energy-efficient design.
Pinout
The microprocessor package typically has a pin count of 256. This LQFP (Low Quad Flat Package) provides various functions through its pins, including power supply, ground connections, data and address buses, control signals, and other specific peripheral interfaces. The pin functions are designed to support rich peripheral connectivity, such as serial communication interfaces (like SCI), USB interfaces, general-purpose I/O, timers, and more.
For precise pin functions and configurations, referring to the manufacturer's datasheet or technical resources for the specific model is recommended.
Manufacturer
Renesas was formed in 2010 following the merger of NEC Electronics Corporation and Renesas Technology Corporation, which was itself a joint venture between Hitachi, Ltd. and Mitsubishi Electric Corporation. The company is headquartered in Tokyo, Japan, and is known for providing high-quality and reliable semiconductor solutions for various industries, including automotive, industrial, consumer electronics, and communications.
Renesas focuses on innovation and offers solutions that support advancements in areas such as the Internet of Things (IoT), autonomous driving, smart factory automation, and more. The company's products are widely used in the design and development of electronic systems that require efficient processing, power management, and connectivity. Overall, Renesas Electronics is considered a key player in the global semiconductor industry.