ICM-20608D

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ICM-20608D

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MOTION TRACKING DEVICE

  • FabricanteTDK InvenSense

  • Peça do Fabricante #ICM-20608D

  • Em Estoque11078

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Especificações

Atributo Valor
Part Status Obsolete
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Description

ICM-20608D is a 6‑axis MEMS inertial measurement unit from InvenSense (TDK) that combines a 3‑axis gyroscope and a 3‑axis accelerometer in a compact package. It provides reliable, low‑noise motion data for orientation and motion sensing, with digital outputs over I2C or SPI and 16‑bit data streams at configurable rates (typically up to ~1 kHz). It includes a temperature sensor and supports various interrupt/power modes for low‑power operation. It does not include a magnetometer (so it’s a 6‑DOF device; add a magnetometer separately for 9‑axis sensing). Common applications include drones, robotics, wearables, VR/AR controllers, and motion‑tracking systems. For integration, calibrate gyroscope/accelerometer biases, set the desired data rate, and implement sensor‑fusion in software. Always consult the latest datasheet for exact electrical specs, package options, and register maps.

Equivalent

Equivalent 6‑axis IMUs to the ICM‑20608D include:
- TDK/Invensense: ICM‑20602, ICM‑20689, ICM‑42688 (newer family members) and legacy MPU series (MPU‑6050/MPU‑6500/MPU‑9250).
- STMicroelectronics: LSM6DS3, LSM6DSOX.
- Bosch Sensortec: BMI160, BMI088.
- Analog Devices: ADIS16470/ADIS16448 (higher‑end IMU modules).
Select based on noise, bandwidth, power, size and interface requirements.

Features

Key features of the ICM-20608D (6‑Axis MEMS MotionTracking):
- 3‑axis accelerometer + 3‑axis gyroscope (6 axes total) with programmable full‑scale ranges (e.g., accel ±2/4/8/16 g; gyro ±250/500/1000/2000 dps).
- Digital interface: supports I2C and SPI for flexible MCU connections.
- High data rate: up to 1 kHz ODR with configurable filtering (LPF) and data-ready interrupts.
- FIFO buffer for efficient data collection and synchronization.
- Low power modes and power-down options; suitable for battery-powered apps.
- On‑chip temperature sensor and self-test capability for calibration and health checks.
- Small package footprint with standard temperature range (typical industrial range −40 to +85°C; variants may offer broader ranges).
- Designed for sensor fusion and motion tracking in wearables, mobile, and embedded systems; supported by common driver/software packages.
Note: exact ODR, power specs, and temp range can vary by revision/package; verify latest datasheet for precise numbers.

Pinout

ICM-20608D: 24-pin LGA package (3.0 × 3.0 × ~1.0 mm).
Primary function: 6‑axis MEMS inertial sensor (3‑axis gyroscope + 3‑axis accelerometer) with onboard signal conditioning, DLPF, FIFO and programmable interrupts.
Typical pin functions (summary):
- Power/Ground: VDD (core supply), VDDIO (I/O supply), GND.
- I2C interface: SDA, SCL (supporting standard I²C address selection via AD0/SDO pin).
- SPI interface: SCLK, SDI (MOSI), SDO (MISO), CS/CSB (chip select) — device supports SPI or I²C.
- Control/aux: INT (interrupt output), FSYNC/AD0 (frame sync or I²C address select), CLKOUT/NC and reserved/No Connect pins.
For exact pin names, locations and electrical specs refer to the official datasheet and pin map.

Manufacturer

- Manufacturer: InvenSense (now a subsidiary of TDK Corporation).
- Company type: A fabless semiconductor company specializing in MEMS motion sensors and inertial measurement units (IMUs) for devices such as smartphones, wearables, drones, and automotive applications.

Application

ICM-20608D is a 6-axis IMU (3-axis gyroscope + 3-axis accelerometer) with I2C/SPI. Common application areas include:
- Drones/UAVs: attitude estimation, stabilization, navigation
- Wearables/mobile devices: activity tracking, gesture control, AR/VR input
- Robotics/automation: pose estimation, motion control, sensor fusion
- Automotive/industrial: inertial sensing for vehicle dynamics, vibration monitoring
- Gaming/consumer electronics: motion sensing for controllers and input devices
- Sports/health: movement analysis, posture monitoring, fall detection
Compact, low-power design suits embedded systems and microcontroller platforms.

Package

The ICM-20608D is supplied in a 3.0 × 3.0 × 0.9 mm 16-pin LGA (land grid array) package, commonly referred to as a QFN/LGA-style surface-mount package.

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