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IS25LP512M-RMLA3
+Lista de MateriaisIC FLASH 512MBIT SPI/QUAD 16SOIC
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FabricanteISSI, Integrated Silicon Solution Inc.
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Peça do Fabricante #IS25LP512M-RMLA3
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Pacote SOIC-16
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Em Estoque2697
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Especificações
| Atributo | Valor |
| Package / Case | Tube |
| Series | Automotive, AEC-Q100 |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 512Mb (64M x 8) |
| Memory Interface | SPI - Quad I/O, QPI, DTR |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word Page | 50µs, 1ms |
| Access Time | 7 ns |
| Voltage - Supply | 2.3V ~ 3.6V |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
Visão Geral
Description
Key features include fast read and write speeds, data retention of up to 20 years, and endurance for over 100,000 program/erase cycles. The IS25LP512M-RMLA3 supports standard, dual, and quad SPI protocols, allowing for flexible interface options. It also incorporates security features such as block protection and a hardware-based reset.
The memory is housed in a compact 8-pin SOIC (Small Outline Integrated Circuit) package, which aids in space-constrained designs. Overall, the IS25LP512M-RMLA3 is suitable for applications requiring reliable, high-density memory with robust performance and low power consumption.
Equivalent
1. Winbond W25Q512JV
2. Macronix MX25L51245G
3. Micron MT25QL512ABB
4. Cypress (Infineon) S25FL512S
These chips offer similar storage capacity, interface, and package options, suitable for applications requiring NOR Flash memory. Always verify specific requirements and consult datasheets to ensure compatibility.
Features
1. Memory Interface: Supports Quad Peripheral Interface (QPI) and Serial Peripheral Interface (SPI) for flexible system integration.
2. Performance: Offers a fast read speed of up to 133 MHz for SPI and 104 MHz for QPI, enhancing data transfer rates.
3. Low Power Consumption: Features deep power-down and standby modes to reduce energy usage.
4. Erase Options: Includes sector, block, and chip erase capabilities for efficient data management.
5. Endurance and Data Retention: Provides high endurance of up to 100,000 program/erase cycles and data retention of more than 20 years.
6. Operating Range: Functions within a wide temperature range, making it suitable for various environments.
7. Security Features: Includes hardware and software protection options for data security.
8. Package Type: Available in a compact SOIC-8 package, facilitating integration in space-constrained applications.
These features make the IS25LP512M-RMLA3 ideal for consumer electronics, industrial, and automotive applications needing reliable and efficient flash memory solutions.
Pinout
1. CS# (Chip Select): Activates the device when low.
2. SO (Serial Output): Outputs data during read operations.
3. WP# (Write Protect): Protects certain memory areas from writing or erasing when low.
4. VSS (Ground): Ground reference for the device.
5. SI (Serial Input): Receives input data and commands.
6. SCK (Serial Clock): Provides the clock signal to synchronize the communication.
7. HOLD# (Hold): Pauses the serial communication when low.
8. VCC (Power Supply): Supplies power to the device.
The IS25LP512M-RMLA3 is designed for high-performance applications, supporting standard, dual, and quad SPI modes for greater flexibility and speed in data operations.
Manufacturer
Application
1. Consumer Electronics: Used in smartphones, tablets, and wearables for firmware storage.
2. Automotive: Employed in infotainment systems and advanced driver-assistance systems (ADAS).
3. Industrial: Utilized in IoT devices, programmable logic controllers (PLCs), and factory automation for reliable data logging and firmware storage.
4. Networking: Applied in routers, switches, and other communication devices for boot code storage.
5. Computing: Integrated into laptops and desktops for BIOS storage and system boot processes.
Its small form factor, low power consumption, and fast read speeds make it suitable for these applications.