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ISL99227BFRZ-T
+Lista de MateriaisCNTRLR SPS MOD SMART PWR 32PQFN
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FabricanteRenesas Electronics America Inc.
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Peça do Fabricante #ISL99227BFRZ-T
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Pacote QFN-32
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Em Estoque2896
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Especificações
| Atributo | Valor |
| Package / Case | Tape & Reel (TR) |
| Part Status | Active |
| Function | Controller |
| Interface | PWM |
| Voltage - Supply | 4.75V ~ 5.25V |
| Supply Current | 4.75 mA |
| Operating Temperature | -40°C ~ 125°C |
Visão Geral
Description
Equivalent
1. Texas Instruments CSD87381P
2. ON Semiconductor FDMF6704
3. Infineon IRF6795MTRPBF
4. Vishay SiC620
These alternatives offer similar specifications and functionalities, making them suitable replacements in similar applications. Always check the datasheets for compatibility with your specific requirements.
Features
1. Integrated Driver and MOSFETs: Combines a high-performance driver and MOSFETs to offer a compact solution.
2. High Efficiency: Optimized for low power loss, the module operates at high efficiency across various loads.
3. Wide Input Voltage Range: Supports a broad range of input voltages, suitable for different applications.
4. Low RDS(ON): Features low on-resistance (RDS(ON)) for reduced conduction losses.
5. Fast Switching: Capable of high-frequency operation, which improves transient response and reduces component size.
6. Protection Features: Includes over-current, over-temperature, and under-voltage protection to enhance reliability.
7. Thermal Performance: Designed for effective heat dissipation, ensuring stable operation under high power conditions.
This module is suitable for applications requiring a compact, efficient, and reliable power solution.
Pinout
The main function of the ISL99227BFRZ-T is to improve power efficiency and simplify the design of DC/DC power regulation circuits. It's commonly used in applications like server processors, graphic cards, and high-performance motherboards. By integrating the MOSFETs and driver in a single package, it reduces the external component count and board space, while enhancing thermal performance and power density.
Manufacturer
Application
1. Server and Networking Equipment: It is used to improve power efficiency and thermal performance in high-performance computing systems.
2. Data Centers: Suitable for power management in data centers requiring reliable and efficient power delivery.
3. Telecommunications: Supports infrastructure needing compact and efficient power stages for various communication devices.
4. Industrial Applications: Used in industrial automation and control systems where high power density and efficiency are critical.
These applications benefit from the module's compact footprint, robust thermal performance, and high power conversion efficiency.