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K4AAG085WA-BCWE
+Lista de MateriaisFBGA-78 Memory (ICs) RoHS
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FabricanteSamsung
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Peça do Fabricante #K4AAG085WA-BCWE
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Em Estoque25255
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Especificações
| Atributo | Valor |
| Packaging | FBGA-78 |
Visão Geral
Description
- Capacity: 8Gb (Gigabit)
- Speed: Up to 4266 Mbps (LPDDR4X standard)
- Low Power: Optimized for mobile/embedded applications
- Voltage: Operates at 1.8V/1.1V/0.6V for efficiency
- Package: Wafer-level packaging (WLP) for compact designs
It is commonly used in smartphones, tablets, IoT devices, and AI edge applications requiring fast, low-power memory. The BCWE suffix may denote specific speed/timing or a custom variant.
For exact specs, refer to Samsung’s official datasheet.
Equivalent
- Micron MT53E512M32D2NP-046 WT:E (LPDDR4X)
- SK Hynix H9HCNNNBKMMLXR-NEE (LPDDR4X)
- Samsung K4UBE3D4AA-MGCL (LPDDR4X)
These alternatives offer similar specs (speed, density, and power efficiency). Verify compatibility with your specific application.
Features
- Capacity: 8GB
- Speed: 3200 Mbps (PC4-25600)
- Voltage: 1.2V (JEDEC standard)
- Organization: 1G x 64-bit (8 banks)
- CAS Latency (CL): 22
- Form Factor: 260-pin SODIMM (for laptops/compact systems)
- ECC Support: No (non-ECC unbuffered)
- Operating Temp: Commercial (0°C to 85°C)
- Manufacturer: SK Hynix
Designed for laptops and small form-factor PCs, it offers high-speed, low-power DDR4 performance. Ideal for upgrades in compatible systems.
Pinout
- Pin Count: 72 pins
- Function: It is a 4Gb (512M x 8) DDR4 SDRAM with:
- 1.2V operating voltage
- 3200 Mbps data rate
- On-Die Termination (ODT)
- Auto-refresh & self-refresh modes
- CAS Latency (CL) support for high-speed operation
This chip is commonly used in servers, networking, and high-performance computing applications.
Manufacturer
This specific module is likely a DDR4 or DDR5 DRAM chip, commonly used in computing devices. SK hynix is known for high-performance, reliable memory solutions.
Application
- Data centers & servers (cloud computing, virtualization)
- Enterprise storage systems (NAS, SAN)
- Networking equipment (routers, switches)
- AI/ML workloads (GPU/CPU acceleration)
- High-end workstations (CAD, video editing)
It offers low power consumption, high speed (3200 Mbps), and reliability, making it ideal for demanding, large-scale computing environments.
Package
Frequently Asked Questions
Q: Is the K4AAG085WA-BCWE a DDR4 or DDR5 memory chip?
A: Based on the Samsung K4A series and FBGA-78 package, it is a DDR4 SDRAM component, commonly used in memory modules.
Q: What is the packaging type for this component?
A: It comes in an FBGA-78 package, which is a Fine-pitch Ball Grid Array with 78 balls for surface-mount assembly.
Q: What typical applications is the K4AAG085WA-BCWE designed for?
A: It is typically used in DDR4 SO-DIMMs or UDIMMs for laptops, desktops, and embedded systems requiring high-speed memory.
Q: Does this part support industrial temperature ranges?
A: The provided parameters do not specify a temperature range. Verify the specific datasheet for commercial or industrial rating.
Q: What is the memory density of the K4AAG085WA-BCWE?
A: The "AAG" in the part number suggests an 8Gb density per die, but confirm with the official Samsung documentation for exact configuration.
Q: Can this component be used for high-performance computing?
A: Yes, as a DDR4 component in FBGA-78, it supports high data rates for general computing, but check the speed grade in the full part number.
