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KLM8G1GEUF-B04P
+Lista de Materiais8GB MLC eMMC 5.1 FBGA-153(11.5x13) Memory (ICs) RoHS
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FabricanteSamsung
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Peça do Fabricante #KLM8G1GEUF-B04P
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Ficha Técnica KLM8G1GEUF-B04P DataSheet
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Especificações
| Atributo | Valor |
| Packaging | FBGA-153(11.5x13) |
| Controller Operating Voltage (VCCQ) | 1.7V~1.95V;2.7V~3.6V |
| Interface | eMMC 5.1 |
| Memory Size | 8GB |
| NAND Operating Voltage (VCCF) | 1.8V;3.3V |
| Operating Temperature | -40℃~+95℃ |
| Reading Speed in Sequence | 330MB/S |
| Writing Speed in Sequence | 40MB/S |
| configuration | MLC |
Visão Geral
Description
The eMMC 5.0 standard offers several enhancements over its predecessors, such as improved speeds for both sequential and random data access, which helps in faster boot times and application loading. The KLM8G1GEUF-B04P utilizes advanced NAND flash technology that ensures higher endurance and data retention, essential for devices with heavy read/write operations.
Incorporating a controller within the package, the KLM8G1GEUF-B04P simplifies the design process for manufacturers by managing bad block management, error correction, and other essential functions. This integration aids in reducing the overall footprint on the device's PCB, fostering more compact and efficient designs.
Equivalent
1. Micron eMMC chips with similar capacity and speed.
2. Hynix eMMC products with matching specifications.
3. Toshiba/Kioxia eMMC chips in the same category.
4. Kingston eMMC solutions with equivalent performance.
Specific model numbers would require direct specification comparisons for precise equivalence.
Features
1. Storage Capacity: Offers 8GB of storage, suitable for a variety of applications in digital devices.
2. eMMC Interface: Complies with JEDEC eMMC 5.0/5.1 standards, providing a standardized interface for easy integration.
3. NAND Flash Technology: Utilizes NAND flash memory, known for its efficiency in read/write operations and durability.
4. Performance: Provides high-speed data transfer rates, which enhances the performance of devices utilizing this module.
5. Endurance and Reliability: Built with error correction and wear leveling, ensuring data integrity and extending the lifespan of the memory.
6. Compact Form Factor: Designed for space-constrained applications, making it ideal for mobile devices, tablets, and other portable electronics.
7. Power Efficiency: Low power consumption, which is beneficial for battery-operated devices.
8. Versatility: Suitable for a wide range of applications, from consumer electronics to industrial uses.
These features make the KLM8G1GEUF-B04P a versatile and reliable choice for embedded storage solutions.
Pinout
Manufacturer
Application
1. Smartphones and Tablets: Provides efficient storage for mobile devices.
2. Embedded Systems: Utilized in industrial and consumer electronics for compact storage.
3. IoT Devices: Supports data storage in various Internet of Things applications.
4. Automotive Systems: Used in infotainment systems and other car electronics.
5. Wearable Technology: Offers storage solutions for devices like smartwatches and fitness trackers.
6. Consumer Electronics: Found in smart TVs, set-top boxes, and digital cameras.
Its compact size, low power consumption, and reliability make it suitable for these diverse applications.
Package
Frequently Asked Questions
Q: What is the storage capacity and NAND configuration of this eMMC?
A: It offers an 8GB memory size using MLC (Multi-Level Cell) NAND flash for balanced performance and endurance.
Q: Which eMMC interface standard does the KLM8G1GEUF-B04P support?
A: It supports the eMMC 5.1 interface standard, ensuring high compatibility with modern application processors.
Q: What are the sequential read and write speeds for this component?
A: It provides a sequential reading speed of 330 MB/s and a sequential writing speed of 40 MB/s.
Q: What is the operating temperature range for this memory?
A: It operates reliably from -40°C to +95°C, making it suitable for industrial and automotive applications.
Q: What voltage supplies are required for the controller and NAND flash?
A: The controller (VCCQ) needs 1.7V~1.95V or 2.7V~3.6V, while the NAND (VCCF) requires 1.8V or 3.3V.
Q: What is the physical package type and dimensions of this device?
A: It comes in a compact FBGA-153 package with dimensions of 11.5mm x 13mm, ideal for space-constrained designs.