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LFE3-70EA-8FN484C
+Lista de MateriaisIC FPGA 295 I/O 484FBGA
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FabricanteLattice Semiconductor Corporation
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Peça do Fabricante #LFE3-70EA-8FN484C
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Ficha Técnica LFE3-70EA-8FN484C DataSheet
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Especificações
| Atributo | Valor |
| Series | ECP3 |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 67000 |
| Total RAM Bits | 4526080 |
| Number of I/O | 295 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 484-BBGA |
| Supplier Device Package | 484-FPBGA (23x23) |
| Base Product Number | LFE3-70 |
| Number of LA Bs / CL Bs | 8375 |
Visão Geral
Description
The LFE3-70EA-8FN484C is optimized for low power consumption and high efficiency, catering to both cost-sensitive and performance-driven applications. It supports a range of I/O standards and protocols, which enhances its versatility in different system architectures. Additionally, the device benefits from Lattice's design tools and software support, facilitating ease of implementation and integration into various projects.
Equivalent
Features
1. Logic Elements: Approximately 70,000 logic elements, providing a good balance between size and power efficiency.
2. Embedded Memory: Includes multiple blocks of embedded RAM, offering up to 5.3 Mb of memory for data storage and buffering.
3. I/O Options: Supports up to 320 user I/Os, with various standards like LVDS, LVPECL, SSTL, and more, allowing for flexible interface designs.
4. SerDes: Features embedded high-speed SerDes channels, supporting data rates up to 3.2 Gbps, suitable for communications and networking applications.
5. DSP Blocks: Contains dedicated DSP blocks for efficient signal processing, enhancing performance in applications requiring arithmetic operations.
6. Packaging: Comes in a 484-ball Fine-Pitch Ball Grid Array (FPBGA) package, allowing for a compact form factor.
7. Power Efficiency: Designed to offer low static and dynamic power consumption, ideal for energy-conscious applications.
These features make the LFE3-70EA-8FN484C suitable for a variety of applications, including telecommunications, wireless infrastructure, and industrial automation.
Pinout
1. Power and Ground Pins: These provide the necessary electrical power and grounding for the FPGA's operation.
2. I/O Pins: Used for general-purpose input/output operations, allowing the FPGA to interface with other devices and systems.
3. Configuration Pins: These are used for configuring the FPGA, enabling it to load a design bitstream during startup.
4. Dedicated Function Pins: Include pins for clock inputs, JTAG interface for testing and programming, and other specialized functions.
5. Additional Specific Functions: Depending on the FPGA’s configuration and user requirements, some pins can be configured for unique functionalities like differential signaling or specific protocol support.
The exact pin allocation can vary based on the design and use case, so it's important to consult the detailed datasheet or user manual provided by Lattice Semiconductor for specific pin functions and assignments.
Manufacturer
Application
1. Communications: Used in wireless infrastructure, networking, and data transmission systems due to its efficient handling of high-speed protocols.
2. Video and Image Processing: Suitable for video conferencing, broadcasting, and surveillance due to its capability for high-speed data processing and image enhancement.
3. Industrial Automation: Employed in control systems and robotics for its reliability and real-time processing capabilities.
4. Consumer Electronics: Integrated into devices for signal processing and interfacing applications.
These areas leverage its cost-effectiveness, low power, and high bandwidth capabilities.