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LFE5U-25F-6BG256C
+Lista de MateriaisIC FPGA 197 I/O 256CABGA
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FabricanteLattice Semiconductor Corporation
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Peça do Fabricante #LFE5U-25F-6BG256C
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Ficha Técnica LFE5U-25F-6BG256C DataSheet
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Pacote LFBGA-256
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | ECP5 |
| Part Status | Active |
| Number of LABs/CLBs | 6000 |
| Number of Logic Elements/Cells | 24000 |
| Total RAM Bits | 1032192 |
| Number of I/O | 197 |
| Voltage - Supply | 1.045V ~ 1.155V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
Housed in a 256-ball grid array (BGA) package, the device supports a variety of I/O standards and offers up to four PLLs for clock management, making it versatile for different design needs. The -6 in its designation indicates the speed grade, with lower numbers typically signifying higher performance.
Key advantages of the LFE5U-25F-6BG256C include low power consumption, small form factor, and cost-effectiveness. It is supported by Lattice’s design tools, which facilitate efficient prototyping and deployment. This FPGA is ideal for applications that benefit from a balance of performance, power efficiency, and cost.
Equivalent
Features
1. Logic Elements: It comprises 24,752 logic elements, allowing for complex designs.
2. Memory: It features up to 1540 Kbits of embedded memory, facilitating efficient data storage and retrieval.
3. I/O Pins: The device offers 197 user I/O pins, providing ample connectivity options.
4. Package: It comes in a 256-ball grid array package (BG256), which is compact and supports high-density applications.
5. Power Efficiency: Designed to operate with low power consumption, making it suitable for power-sensitive applications.
6. High-Speed Interfaces: Includes support for high-speed SerDes, suitable for interfaces like PCI Express and Gigabit Ethernet.
7. Development Support: Supported by Lattice's software tools, facilitating design and implementation.
8. Applications: Ideal for use in applications such as industrial automation, communications, and consumer electronics.
These features make the LFE5U-25F-6BG256C a versatile choice for diverse applications requiring efficient computation and connectivity.
Pinout
1. Logic Cells: It offers an array of logic cells that can be configured for custom digital logic.
2. I/O Blocks: It includes multiple general-purpose I/O pins for interfacing and connectivity.
3. DSP Blocks: Equipped with specialized DSP blocks for arithmetic operations, particularly useful in signal processing.
4. Embedded Memory: Contains on-chip RAM blocks for storage and buffering.
5. Clock Management: Features PLLs (Phase-Locked Loops) for clock management and timing control.
6. SERDES & High-Speed I/O: Supports high-speed serial interfaces for enhanced data throughput.
7. Power Management: Designed for low-power operation, suitable for energy-efficient applications.
These features make the LFE5U-25F-6BG256C ideal for applications in communications, consumer electronics, and industrial markets.
Manufacturer
Application
1. Communications Infrastructure: Ideal for implementing data processing, packet switching, and protocol bridging in wireless and wired networks.
2. Industrial Automation: Used in programmable logic controllers (PLCs) and motor control systems.
3. Consumer Electronics: Supports applications such as video processing and interface bridging.
4. Automotive Systems: Applied in infotainment systems and advanced driver-assistance systems (ADAS).
5. IoT Devices: Facilitates connectivity and data processing in IoT applications.
These applications leverage the chip's balance of power efficiency, performance, and small form factor.