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M15T1G1664A
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FabricanteJLCPCB Assembly
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Peça do Fabricante #M15T1G1664A
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Especificações
| Atributo | Valor |
| Manufacturer | JLCPCB Assembly |
| Package | TFBGA-96_L13.0-W7.5-R16-C6-P0.80-TL |
Visão Geral
Equivalent
- IS43TR16256A (Integrated Silicon Solution Inc.)
- MT46H128M16 (Micron Technology)
- K4B1G1646G (Samsung)
- W971GG6KB (Winbond)
These are 1Gb DDR1/DDR2 chips with similar specs (16-bit bus, 1664Mb density). Verify pin compatibility and timing parameters before substitution.
Features
- Capacity: 1 Gigabit (organized as 64Mx16)
- Voltage: 1.8V (low-power operation)
- Speed: DDR-266/333/400 (133/166/200 MHz clock)
- Package: 60-ball FBGA (Fine-pitch Ball Grid Array)
- CAS Latency (CL): 2, 2.5, or 3 (speed-dependent)
- Burst Length: 2, 4, or 8
- Refresh: Auto-refresh & self-refresh modes
- Operating Temp: Commercial (0°C to 70°C) or Industrial (-40°C to 85°C)
Designed for embedded systems, networking, and consumer electronics, it offers low power consumption and high-speed data transfer.
Pinout
Key Functions:
- 16-bit data bus
- 4 internal banks
- Operating voltage: 2.5V ± 0.2V
- Supports CAS latencies (CL): 2, 2.5, 3
- Burst lengths: 2, 4, 8
- Auto refresh & self refresh modes
Common applications include embedded systems, networking devices, and consumer electronics.