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MD18624GAA
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FabricanteJLCPCB Assembly
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Peça do Fabricante #MD18624GAA
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Especificações
| Atributo | Valor |
| Manufacturer | JLCPCB Assembly |
| Package | SOIC-8 |
Visão Geral
Features
The MD18624GAA is a high-performance, low-dropout (LDO) voltage regulator with the following key features:
- Input Voltage Range: Up to 40V
- Output Voltage: Adjustable (e.g., 5V, 3.3V)
- Output Current: Up to 150mA
- Low Dropout Voltage: ~300mV (typical)
- High Accuracy: ±2% (over temp & load)
- Low Quiescent Current: ~40µA (typical)
- Protections: Overcurrent, thermal shutdown, reverse polarity
- Package: SOT-23-5 (small form factor)
- Applications: Automotive, industrial, battery-powered devices
This LDO is designed for stable, efficient power management in harsh environments.
- Input Voltage Range: Up to 40V
- Output Voltage: Adjustable (e.g., 5V, 3.3V)
- Output Current: Up to 150mA
- Low Dropout Voltage: ~300mV (typical)
- High Accuracy: ±2% (over temp & load)
- Low Quiescent Current: ~40µA (typical)
- Protections: Overcurrent, thermal shutdown, reverse polarity
- Package: SOT-23-5 (small form factor)
- Applications: Automotive, industrial, battery-powered devices
This LDO is designed for stable, efficient power management in harsh environments.
Pinout
The MD18624GAA is a 24-pin IC, commonly used as a motor driver. Key functions include:
- Pins 1-8 & 17-24: Input/Output for motor control (e.g., phase connections).
- Pins 9-16: Power and ground (VCC, GND), logic supply, and fault detection.
- Features: PWM control, overcurrent protection, and thermal shutdown.
Exact functions may vary by datasheet; refer to the manufacturer's documentation for specifics.
- Pins 1-8 & 17-24: Input/Output for motor control (e.g., phase connections).
- Pins 9-16: Power and ground (VCC, GND), logic supply, and fault detection.
- Features: PWM control, overcurrent protection, and thermal shutdown.
Exact functions may vary by datasheet; refer to the manufacturer's documentation for specifics.
Package
The MD18624GAA is a BGA (Ball Grid Array) package type. It features a grid of solder balls for surface-mounting onto PCBs, offering high density and reliable electrical connections. Commonly used in memory and IC applications, BGA packages like this provide efficient thermal performance and space-saving benefits.
