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MIMXRT685SFVKB
+Lista de MateriaisIC MCU 32BIT EXT MEM 176VFBGA
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FabricanteNXP USA Inc.
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Peça do Fabricante #MIMXRT685SFVKB
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Pacote VFBGA-176
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Em Estoque2880
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | RT-600 |
| ProductStatus | Active |
| CoreProcessor | ARM® Cortex®-M33 |
| CoreSize | 32-Bit Dual-Core |
| Speed | 300MHz |
| Connectivity | EBI/EMI, I²C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| NumberofI/O | 96 |
| ProgramMemoryType | External Program Memory |
| RAMSize | 4.5M x 8 |
| Voltage-Supply(Vcc/Vdd) | 1.71V ~ 3.6V |
| DataConverters | A/D 12x12b |
| OscillatorType | Internal |
| OperatingTemperature | -20°C ~ 70°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 176-VFBGA |
Visão Geral
Description
Key features include:
- 2MB flash, 5.5MB RAM (including OCRAM and TCM)
- Secure boot, TrustZone, and cryptographic accelerators for enhanced security
- Rich peripherals: USB, SPI, I2C, UART, CAN, and a 16-bit ADC
- Low-power modes for battery-operated devices
- Graphics support via LCD and camera interfaces
Ideal for smart home, wearables, and edge AI applications, the MIMXRT685SFVKB balances performance, power efficiency, and security in a BGA-225 package.
For more details, refer to NXP's datasheet or product page.
Equivalent
1. NXP MIMXRT595S (similar Cortex-M33 + Cadence DSP, lower RAM)
2. NXP MIMXRT1050 (Cortex-M7, no DSP but higher performance)
3. STMicro STM32H7 (Cortex-M7/M4, comparable performance)
4. Renesas RA6M5 (Cortex-M33, similar features)
Check specs for exact match based on your needs (DSP, RAM, peripherals).
Features
- Dual-Core Processor: 300 MHz Arm Cortex-M33 (main core) + 600 MHz Cadence Tensilica HiFi 4 DSP (audio processing).
- Memory: 4.5 MB SRAM (2.5 MB general-purpose + 2 MB audio-optimized), supports external flash via FlexSPI.
- Security: Hardware-accelerated AES, SHA, PKHA, TRNG, and secure boot.
- Connectivity: USB 2.0 OTG, 2x FlexCOMM (supports UART, SPI, I2C, I2S), 10/100 Ethernet, CAN FD.
- Audio: Dedicated DSP for voice/audio processing, PDM microphone interface.
- Peripherals: 12-bit ADC, DAC, PWM, GPIOs, and capacitive touch sensing.
- Power Efficiency: Multiple low-power modes for battery-operated applications.
- Package: 100-pin VFBGA (5x5 mm).
Ideal for voice-enabled IoT, wearables, and embedded audio applications.
Pinout
- Dual-core: Arm Cortex-M33 (main) + Cadence Tensilica HiFi 4 DSP (audio).
- Memory: 4MB flash, 5.5MB SRAM (including 2MB Tightly Coupled Memory).
- Interfaces: USB 2.0, SPI, I²C, UART, I²S, CAN FD, SDIO, and parallel camera.
- Security: AES, SHA, PUF, and secure boot.
- GPIOs: Multiple configurable pins for peripheral control.
Designed for high-performance embedded applications like audio, IoT, and industrial systems.
Manufacturer
Application
1. Audio Processing – High-performance DSP for voice assistants, noise cancellation.
2. IoT Edge Devices – Secure, low-power connectivity (Wi-Fi, Bluetooth).
3. Industrial Automation – Real-time control, HMI, and motor control.
4. Wearables – Efficient processing for smartwatches/fitness trackers.
5. AI/ML at the Edge – Supports lightweight neural networks.
Its Cortex-M33 core + Cadence Tensilica HiFi 4 DSP enables robust signal processing and power efficiency.