MPC852TVR100A

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MPC852TVR100A

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IC MPU MPC8XX 100MHZ 256BGA

  • FabricanteNXP USA Inc.

  • Peça do Fabricante #MPC852TVR100A

  • Pacote MAPBGA-169

  • Em Estoque2496

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Especificações

Atributo Valor
Package Bulk,Tray
Series MPC8xx
ProductStatus Obsolete
CoreProcessor MPC8xx
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 100MHz
Co-Processors/DSP Communications; CPM
RAMControllers DRAM
GraphicsAcceleration No
Ethernet 10Mbps (1)
Voltage-I/O 3.3V
OperatingTemperature 0°C ~ 95°C (TA)
Package/Case 256-BBGA

Visão Geral

Description

The MPC852TVR100A is a member of the MPC850 family, a series of integrated communications processors developed by Freescale Semiconductor (formerly Motorola). This particular model is designed for embedded applications requiring a blend of performance and functionality. The processor operates at a clock speed of 100 MHz and incorporates a PowerPC core, which is known for its efficient processing capabilities.
Key features of the MPC852TVR100A include an integrated communications processor module (CPM) that supports multiple networking protocols, making it ideal for applications in telecommunications and data communications. It also includes various peripheral interfaces such as UART, I2C, SPI, and Ethernet, allowing for versatile connectivity options.
The chip is built on a reduced instruction set computing (RISC) architecture, which helps in achieving high performance while maintaining low power consumption. This balance makes it suitable for applications such as routers, network switches, and other embedded systems that require reliable communication processing abilities. Its robust design and versatile features make it a valuable component in the field of embedded system design.

Equivalent

The MPC852TVR100A is a PowerQUICC microprocessor from NXP (formerly Freescale). Equivalent products would be other microprocessors in the PowerQUICC family, such as the MPC850 or MPC860 series, depending on specific performance and feature requirements. Additionally, microcontrollers from other manufacturers like Texas Instruments' Sitara AM335x series or Microchip's PIC32MZ series might be considered alternatives, depending on the application needs. Always compare specific features like clock speed, peripherals, and power consumption.

Features

The MPC852TVR100A is a member of the PowerQUICC family of microprocessors, designed for embedded applications. It integrates a high-performance 32-bit PowerPC core, specifically the MPC8xx core, with a communications processor module. Key features include:
1. CPU Performance: The device operates at a clock speed of 100 MHz, offering efficient processing capabilities for embedded systems.
2. Memory: It supports various memory interfaces, including SDRAM, Flash, and EPROM, providing flexibility in memory configurations.
3. Communication Interfaces: The processor includes multiple communication interfaces, such as Ethernet, UART, I2C, and SPI, ensuring robust connectivity options.
4. Peripheral Support: It includes a range of peripheral support features, including timers, parallel I/O ports, and system integration modules.
5. Power Management: Designed for low-power consumption, making it suitable for power-sensitive applications.
6. Versatility: The MPC852TVR100A is suitable for use in networking equipment, telecommunications systems, and industrial control applications due to its versatile and reliable processing capabilities.
These features make the MPC852TVR100A an effective choice for developers seeking a balance of performance, connectivity, and power efficiency in their designs.

Pinout

The MPC852TVR100A is a member of the MPC8xx family of PowerPC microprocessors developed by Motorola (now NXP Semiconductors). It typically features a 357-pin Ball Grid Array (BGA) package. The MPC852T microprocessor is designed for embedded applications and offers various functionalities including integrated communications capabilities, which are particularly suited for networking and telecommunications applications.
Key functions include:
1. Core Processor: It features a PowerPC core capable of handling complex computations and control tasks.
2. Communications Processor Module (CPM): Provides support for multiple communication protocols, ideal for networking.
3. Integrated Peripherals: Includes timers, serial interfaces, and other standard microcontroller peripherals.
4. Memory Interface: Supports different types of memory, allowing for flexible embedded design implementations.
This processor is designed to provide a balance of performance, power efficiency, and integration to meet the needs of embedded systems. For detailed specifications or design integration, referring to the specific datasheets and technical manuals from the manufacturer is recommended.

Manufacturer

The MPC852TVR100A is manufactured by NXP Semiconductors. NXP is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in the design and production of a wide array of semiconductor products, including microcontrollers, processors, and integrated circuits for various applications. The company serves multiple industries such as automotive, industrial, mobile, and communication infrastructure. Known for its innovation and emphasis on security, NXP is a prominent player in the development of secure connectivity solutions for embedded applications.

Application

The MPC852TVR100A is a microprocessor used in embedded systems and telecommunications applications. It is well-suited for applications requiring network connectivity, such as routers, gateways, and network switches. Additionally, it can be employed in industrial automation systems, automotive control systems, and consumer electronics due to its robust processing capabilities. The processor supports real-time operations, making it ideal for systems that require precise timing and control. Its versatility and efficiency in power consumption also make it suitable for portable and battery-operated devices.

Package

The MPC852TVR100A is a microprocessor from NXP (formerly Freescale). It typically comes in a plastic ball grid array (PBGA) package, which is commonly used for its effective heat dissipation and compact form factor, making it suitable for embedded systems applications.

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