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MT29F1G08ABAEAH4-ITX:E
+Lista de MateriaisIC FLASH 1GBIT PARALLEL 63VFBGA
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FabricanteMicron Technology Inc.
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Peça do Fabricante #MT29F1G08ABAEAH4-ITX:E
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Em Estoque7734
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Especificações
| Atributo | Valor |
| Part Status | Obsolete |
| Base Product Number | MT29F1G08 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (9x11) |
| Packaging | Tray |
Visão Geral
Description
The "IT" designation indicates an industrial temperature range, which typically supports operations from -40°C to +85°C, making it suitable for use in more demanding environments. The "X" at the end of the product code usually denotes packaging type or a specific feature set. Overall, this flash memory chip is designed for reliability and performance, balancing storage capacity with durability, which makes it ideal for industrial and consumer applications requiring robust data storage solutions.
Equivalent
1. Samsung K9F1G08U0D: A similar 1Gb NAND flash memory chip.
2. Toshiba TC58NVG0S3HTA00: Another 1Gb NAND flash offering similar specifications.
3. Hynix HY27UF081G2A: A 1Gb NAND flash memory chip with comparable features.
These alternatives should be checked for compatibility in terms of package type, voltage, and performance specifications.
Features
1. Capacity: 1 Gb (Gigabit).
2. Interface: Uses an 8-bit I/O interface.
3. Package: Available in a TSOP (Thin Small-Outline Package).
4. Operating Temperature Range: Designed to function in industrial temperature ranges, typically from -40°C to +85°C.
5. Endurance and Data Retention: Offers high endurance with a typical data retention of 10 years.
6. Page Size: 2K bytes per page with additional spare bytes for ECC (Error-Correcting Code).
7. Block Size: 128 pages per block.
8. Low Power Consumption: Designed for low power usage, which is critical for battery-powered applications.
9. Reliability: Built with ECC support to ensure data integrity.
These features make the MT29F1G08ABAEAH4-ITX:E suitable for applications where reliability and data integrity are crucial.
Pinout
The MT29F1G08ABAEAH4-ITX:E package typically features a 48-pin TSOP (Thin Small Outline Package). The pin count and functions are standard for a NAND Flash device, including:
- I/O Pins: Used for input and output operations.
- CLE (Command Latch Enable): Indicates that the command cycle is in progress.
- ALE (Address Latch Enable): Indicates that the address cycle is in progress.
- CE# (Chip Enable): Activates the chip for operation.
- WE# (Write Enable): Initiates a write operation.
- RE# (Read Enable): Initiates a read operation.
- WP# (Write Protect): Protects the device from accidental writes.
- R/B# (Ready/Busy): Indicates the status of the device.
- VCC: Power supply pin.
- VSS: Ground pin.
These pins are essential for the operation and communication with the host controller in the system where the NAND Flash is integrated.
Manufacturer
Application
Package
Frequently Asked Questions
Q: Is the MT29F1G08ABAEAH4-ITX:E a NAND or NOR Flash device?
A: It is a NAND Flash device, using FLASH - NAND technology for non-volatile data storage.
Q: What is the memory density and organization of this part?
A: The memory size is 1Gbit, organized as 128M x 8 bits (128 Megawords by 8 bits).
Q: What voltage supply range does this NAND Flash require?
A: It requires a supply voltage between 2.7V and 3.6V, suitable for standard 3.3V systems.
Q: What is the operating temperature range for this component?
A: The operating temperature range is -40°C to 85°C (TA), making it suitable for industrial applications.
Q: Which package type is this device available in?
A: It is offered in a 63-VFBGA package (Supplier Package: 63-VFBGA 9x11), designed for surface mount assembly.
Q: Is the MT29F1G08ABAEAH4-ITX:E still in active production?
A: No, its Part Status is listed as Obsolete. Check alternative or end-of-life stock before new designs.
Q: What memory interface does this Flash device support?
A: It features a Parallel memory interface, common for legacy NAND Flash controllers.
Q: Can this device be used in applications requiring high-speed erasure?
A: Yes, as a NAND Flash, it supports fast block erase operations, ideal for file storage and firmware updates.