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MT29F2G08ABBEAH4-IT:E
+Lista de MateriaisIC FLASH 2GBIT PARALLEL 63VFBGA
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FabricanteMicron Technology Inc.
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Peça do Fabricante #MT29F2G08ABBEAH4-IT:E
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Em Estoque3344
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Especificações
| Atributo | Valor |
| Part Status | Last Time Buy |
| Base Product Number | MT29F2G08 |
| DigiKey Programmable | Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 2Gbit |
| Memory Organization | 256M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (9x11) |
| Packaging | Tray |
Visão Geral
Description
Key features of the MT29F2G08ABBEAH4-IT:E include its small form factor, low power consumption, and robust performance in a variety of environmental conditions. It operates effectively within the industrial temperature range, making it suitable for applications in harsh environments, such as automotive, industrial, and networking sectors.
This NAND Flash device supports high-speed data transfer rates and is designed for efficient storage management, offering features such as wear leveling and error correction to ensure data integrity and reliability. Its compact design and high capacity make it ideal for use in embedded systems, solid-state drives (SSDs), and other applications requiring reliable non-volatile memory solutions.
Equivalent
Features
1. Capacity: 2Gb (Gigabits) of storage, organized in a x8 configuration.
2. Architecture: Utilizes a multi-level cell (MLC) NAND architecture, allowing for more data storage in the same physical space compared to single-level cell (SLC) technologies.
3. Package: Typically housed in a 48-pin TSOP (Thin Small Outline Package) for easy integration into a variety of electronic devices.
4. Performance: Offers fast read and write times suitable for applications requiring efficient data handling.
5. Temperature Range: Industrial temperature range of -40°C to +85°C, making it suitable for use in a wide range of environmental conditions.
6. Endurance and Reliability: Designed for a high number of program/erase cycles, enhancing longevity and reliability in data storage applications.
7. Interfaces: Supports standard NAND interface, making it compatible with numerous controllers and systems.
These features make it suitable for embedded systems, industrial applications, and consumer electronics where robust and reliable data storage is required.
Pinout
1. Data Inputs/Outputs (DQ0-DQ7): These are used for data input and output operations.
2. Address Inputs (A0-A4): Used for addressing memory locations.
3. Chip Enable (CE#): Activates the chip.
4. Read Enable (RE#): Controls data output.
5. Write Enable (WE#): Controls data input.
6. Command Latch Enable (CLE): Latches command data.
7. Address Latch Enable (ALE): Latches address data.
8. Ready/Busy (R/B#): Indicates the device's status.
9. Write Protect (WP#): Protects the device from inadvertent programming or erasing.
10. Vcc: Power supply pin.
11. Vss: Ground pin.
These functions are crucial for the operation of the NAND Flash memory, providing the necessary interface for reading, writing, and controlling the memory. For specific electrical characteristics and timing, refer to the detailed datasheet provided by the manufacturer.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of this NAND Flash?
A: It is a 2Gbit NAND Flash organized as 256M x 8 bits, suitable for high-density data storage.
Q: What voltage range does this MT29F2G08ABBEAH4-IT:E support?
A: It operates on a low voltage supply of 1.7V to 1.95V, ideal for power-sensitive designs.
Q: Can this device operate in extreme temperature environments?
A: Yes, it has an industrial temperature range of -40°C to +85°C, ensuring reliability in harsh conditions.
Q: What is the memory interface type for this component?
A: It uses a parallel memory interface, enabling fast read/write operations in embedded systems.
Q: Is this component available for new designs given its Last Time Buy status?
A: No, it is in "Last Time Buy" status; final purchases are recommended for sustaining existing production.
Q: What package does this NAND Flash come in?
A: It is supplied in a 63-VFBGA (9x11mm) surface-mount package, occupying minimal PCB space.
Q: Does this memory require an external voltage regulator for its core?
A: No, the core operates directly from the provided 1.7V to 1.95V supply without external regulation.