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MT29F32G08ABCDBJ4-6ITR:D
+Lista de MateriaisIC FLASH 32GBIT PAR 132VBGA
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FabricanteMicron Technology Inc.
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Peça do Fabricante #MT29F32G08ABCDBJ4-6ITR:D
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Em Estoque2164
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Especificações
| Atributo | Valor |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 32Gbit |
| Memory Organization | 4G x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 132-VBGA |
| Supplier Device Package | 132-VBGA (12x18) |
| Base Product Number | MT29F32G08 |
| Clock Frequency | 166 MHz |
Visão Geral
Description
It is designed for high-density applications, making it suitable for smartphones, tablets, solid-state drives (SSDs), and other consumer electronics. The device offers features like advanced error correction, wear leveling, and power management to ensure data integrity and longevity. The '-6ITR' suffix indicates specific speed and packaging options, while ':D' denotes that it is a lead-free, RoHS-compliant product.
Overall, the MT29F32G08ABCDBJ4-6ITR:D is an efficient and reliable choice for modern flash storage needs, balancing performance, capacity, and endurance.
Equivalent
Features
- Density: 32 Gb (4 GB)
- Architecture: 8-bit width (x8)
- Interface: ONFI (Open NAND Flash Interface) compliant for compatibility
- Speed: 6 ns access time
- Endurance: Supports 3,000 program/erase cycles
- Data Retention: Typically retains data for 10 years at 25°C
- Temperature Range: Industrial (-40°C to 85°C)
- Packaging: Available in a 48-ball FBGA package
This chip is ideal for applications requiring high-density storage with robust data retention and reliability, such as consumer electronics, automotive systems, and industrial applications.
Pinout
1. Data Input/Output (DQ0-DQ7): These 8 pins are used for data transfer between the memory and the host.
2. Command/Address pins (A0-A23): These 24 pins are used to address the memory cells and control commands.
3. Chip Enable (CE): This pin activates the chip for operation.
4. Write Enable (WE): This pin allows writing data to the memory.
5. Read Enable (RE): This pin enables reading data from the memory.
6. Ready/Busy (R/B): This pin indicates the status of the device (ready or busy).
7. Reset (RESET): This pin resets the device.
8. VCC and VSS: These pins provide power supply and ground connections.
This NAND Flash memory is typically used in applications requiring high-density storage.
Manufacturer
Micron's products are integral to modern electronics, enabling advancements in technology across devices such as smartphones, laptops, and data centers. The company's focus on research and development allows it to innovate and maintain competitiveness in the fast-evolving landscape of memory technology. Micron's commitment to quality and performance has established it as a trusted supplier for numerous technology companies worldwide.
Application
1. Mobile Devices: Smartphones and tablets for storage expansion.
2. Consumer Electronics: Digital cameras, gaming consoles, and smart TVs.
3. Embedded Systems: Automotive applications and industrial controls.
4. Data Storage: Solid-state drives (SSDs) and USB flash drives.
5. IoT Devices: Smart home products and connected sensors.
6. Networking Equipment: Routers and switches for firmware and data storage.
Its high density and reliability make it suitable for data-intensive applications.