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MT29F64G08CBABAWP:B
+Lista de MateriaisIC FLSH 64GBIT PARALLEL 48TSOP I
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FabricanteMicron Technology Inc.
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Peça do Fabricante #MT29F64G08CBABAWP:B
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Pacote TFSOP-48
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Em Estoque6463
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Especificações
| Atributo | Valor |
| Package / Case | Bulk |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 64Gb (8G x 8) |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
Visão Geral
Description
Key features include:
1. High Density and Scalability: Offers a large storage capacity, suitable for applications requiring significant data storage.
2. Performance: Designed for fast read and write operations, enhancing overall system performance.
3. Reliability: Incorporates advanced error correction mechanisms to ensure data integrity and longevity of the chip.
4. Power Efficiency: Optimized for lower power consumption, making it ideal for battery-operated devices.
5. Compatibility: Supports a range of standard interfaces, allowing for integration into various systems.
Overall, the MT29F64G08CBABAWP:B is a versatile NAND flash memory chip, balancing high performance, efficiency, and reliability for modern storage demands.
Equivalent
1. Samsung K9GAG08U0E - a 64Gb MLC NAND from Samsung.
2. Toshiba TH58NVG7S2HTA20 - a 64Gb NAND flash.
3. SK Hynix H27UAG8T2A - a 64Gb MLC NAND.
These chips would have comparable storage capacities and performance characteristics for similar applications.
Features
Key features include a high-performance read and write capability, endurance suited for applications with frequent write and erase cycles, and a robust design for data integrity and longevity. The chip is commonly used in embedded systems, industrial applications, and other devices where reliability is critical. Additionally, it supports features like ECC (Error Correction Code) to enhance data integrity and reliability. The package type for this model is typically a TSOP (Thin Small Outline Package) or similar, designed for easy integration into various hardware designs.
Pinout
- Power Supply Pins: Provide necessary voltage to the chip.
- Control Pins: Include Chip Enable (CE#), Write Enable (WE#), Read Enable (RE#), and Command Latch Enable (CLE), which control the reading and writing operations.
- Data Input/Output Pins (I/O): Usually a set of 8 pins (I/O0–I/O7) used for data transfer.
- Address Latch Enable (ALE): Used to latch addresses in the command interface.
- Ready/Busy (R/B#): Indicates the status of the chip, whether it is busy or ready for the next command.
- Write Protect (WP#): Used to protect the memory from being written to.
- Ground and VCC Pins: Provide ground and power connections.
This configuration allows the chip to efficiently handle read, write, and erase operations typical in NAND Flash memory usage.
Manufacturer
Micron is known for its innovation and advancements in memory technology, making it one of the leading companies in the semiconductor industry. The company serves a diverse range of markets, including consumer electronics, telecommunications, automotive, and industrial applications. Micron's focus is on providing high-performance, reliable, and efficient memory solutions that enable the advancement of technology across these sectors.
Application
1. Consumer Electronics: Used in smartphones, tablets, and digital cameras for storing operating systems and user data.
2. Solid-State Drives (SSDs): Integrated into SSDs for faster data access and improved storage capacity.
3. Embedded Systems: Implemented in industrial and automotive systems for critical data retention and booting processes.
4. Networking Equipment: Utilized in routers and switches to store firmware and configuration data.
5. Medical Devices: Employed for secure data logging and retrieval.
These applications leverage its high capacity, reliability, and durability.