MT29F8G08ABACAH4-IT:C

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MT29F8G08ABACAH4-IT:C

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IC FLASH 8GBIT PARALLEL 63VFBGA

  • FabricanteMicron Technology Inc.

  • Peça do Fabricante #MT29F8G08ABACAH4-IT:C

  • Em Estoque4623

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Especificações

Atributo Valor
Part Status Active
Base Product Number MT29F8G08
Digi Key Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 8Gbit
Memory Organization 1G x 8
Memory Interface Parallel
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 63-VFBGA
Supplier Device Package 63-VFBGA (9x11)
Packaging Tray

Visão Geral

Description

The MT29F8G08ABACAH4-IT:C is a NAND flash memory device manufactured by Micron Technology. It features 8 gigabits (1 gigabyte) of storage capacity and employs a toggle NAND interface, which allows for high-speed data transfer rates. This device is typically used in applications such as mobile phones, tablets, and other consumer electronics, where compact and efficient storage solutions are essential.
This particular model is designed for industrial temperature ranges, ensuring reliable performance in demanding environments. It supports a range of features, including advanced error correction, wear leveling, and bad block management, enhancing data integrity and longevity. The device operates on a 3.3V power supply and comes in a small BGA (Ball Grid Array) package, facilitating easy integration into compact designs.
Overall, the MT29F8G08ABACAH4-IT:C is suitable for applications requiring high-density, reliable, and efficient non-volatile storage.

Equivalent

The MT29F8G08ABACAH4-IT:C is a 8Gb NAND Flash memory chip. Equivalent products include the Samsung K9GAG08U0M, Hynix H27UBG8T2BTR, and Toshiba TC58NVG0S3HBAI4. Ensure compatibility in terms of specifications, such as voltage, interface, and package type when considering alternatives.

Features

The MT29F8G08ABACAH4-IT:C is a NAND flash memory device from Micron Technology. Key features include:
1. Capacity: 8 Gb (1 GB) storage.
2. Interface: ONFI 1.0 compliant interface for compatibility and ease of integration.
3. Organization: 2048 pages per block, with each page being 4KB in size.
4. Data Transfer Rates: Supports high-speed read and write operations, enhancing performance for applications.
5. Endurance: Typically rated for 3,000 to 10,000 program/erase cycles, suitable for consumer and industrial applications.
6. Low Power Consumption: Designed for energy efficiency, making it ideal for portable devices.
7. Temperature Range: Industrial grade, operating from -40°C to +85°C, ensuring reliability in harsh environments.
8. ECC Support: Built-in error correction capabilities to enhance data integrity.
This device is commonly used in applications like mobile devices, automotive systems, and various embedded platforms.

Pinout

The MT29F8G08ABACAH4-IT:C is a NAND flash memory device with a total of 48 pins. It is organized in a way that supports an 8-bit data bus. The primary functions of its pins include:
1. Data Pins (D0-D7): These are used for data input and output.
2. Command Interface Pins: Including CE# (Chip Enable), RE# (Read Enable), WE# (Write Enable), which control the device's operation.
3. Address Pins (A0-A19): Used to address the memory cells within the chip.
4. Status and Control Pins: Such as WP# (Write Protect) and R/B# (Ready/Busy), indicating the status of operations.
5. Power Supply Pins: Including Vcc and Vss for power and ground connections.
This device falls under the category of SLC (Single-Level Cell) NAND flash, providing high performance and durability for storage applications.

Manufacturer

The manufacturer of the MT29F8G08ABACAH4-IT:C is Micron Technology, Inc. Micron is a global leader in the semiconductor industry, specializing in memory and storage solutions. Founded in 1978 and headquartered in Boise, Idaho, the company produces a range of products, including DRAM, NAND flash memory, and solid-state drives (SSDs). Micron serves various markets, including computing, mobile, consumer electronics, automotive, and industrial applications.
As a major player in the semiconductor market, Micron focuses on innovation and technology development, offering advanced memory solutions that support the growing demand for data storage and processing capabilities in modern electronic devices. The company's commitment to research and development enables it to stay competitive in an evolving industry, addressing the needs of customers across diverse sectors.

Application

The MT29F8G08ABACAH4-IT:C is a 8Gb NAND Flash memory chip used primarily in embedded systems. Its application areas include consumer electronics (smartphones, tablets), automotive (infotainment systems), industrial applications (data logging, control systems), and networking equipment (routers, switches). It is suitable for applications requiring high-density storage, fast data access, and reliability, making it ideal for firmware storage, multimedia content, and file storage in various devices.

Package

The MT29F8G08ABACAH4-IT:C is packaged in a 48-ball FBGA (Fine Pitch Ball Grid Array) format. This type of package is characterized by its small footprint and high density, suitable for space-constrained applications in mobile and embedded systems.

Frequently Asked Questions


Q: What is the memory capacity and organization of the MT29F8G08ABACAH4-IT:C?
A: It has an 8Gbit memory size with a 1G x 8 organization, suitable for high-density data storage.


Q: What type of memory technology does this component use?
A: It utilizes NAND Flash non-volatile memory, ideal for reliable long-term data retention.


Q: What is the operating voltage range for this device?
A: It operates from 2.7V to 3.6V, ensuring compatibility with standard 3.3V power rails.


Q: What is the temperature range of this component for industrial use?
A: It supports an operating temperature range of -40°C to 85°C, suitable for harsh environments.


Q: What interface does this NAND Flash use for data transfer?
A: It features a parallel memory interface for high-speed read and write operations.


Q: What is the package type and dimensions for mounting?
A: It comes in a 63-VFBGA surface-mount package, with a supplier device package size of 9x11mm.


Q: Is this component suitable for new designs or replacement use?
A: Yes, its Active part status and tray packaging support both new designs and production runs.


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