Imagens apenas para referência
MT40A256M16GE-083E IT:B
+Lista de MateriaisDRAM DRAM DDR4 Z90B 4Gb
-
FabricanteMicron
-
Peça do Fabricante #MT40A256M16GE-083E IT:B
-
Ficha Técnica MT40A256M16GE-083E IT:B DataSheet
-
Em Estoque23155
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Packaging | Tray |
| Standard Pack Qty | 1020 |
Visão Geral
Description
The "083E" in its designation typically refers to specific timing and speed characteristics, while "IT" indicates that the module is rated for industrial temperature ranges, making it robust and reliable under various environmental conditions. The "B" at the end usually denotes a revision or version of the product.
Overall, the MT40A256M16GE-083E IT:B offers enhanced energy efficiency, increased memory bandwidth, and reliability, contributing to reduced power consumption while supporting fast data processing tasks. This makes it an ideal choice for both consumer and industrial applications where performance and durability are key considerations.
Equivalent
1. Samsung K4A8G165WB-BCTD - A DDR4 SDRAM with similar specifications.
2. SK Hynix H5AN8G6NCJR-TFC - Another DDR4 SDRAM with comparable features.
3. Kingston D4CNF8PHJ2TAYR - A Kingston equivalent for DDR4 memory.
These products typically offer similar performance characteristics and are used in similar applications. However, always check specific datasheets for detailed compatibility.
Features
1. Density and Organization: This memory module has a 4Gb density and is organized as 256M x 16.
2. Data Rate and Bandwidth: It supports a data rate of 3200 MT/s, which provides a high bandwidth suitable for intensive computing tasks.
3. Voltage: Operates at a supply voltage of 1.2V, which is standard for DDR4 memory, offering efficient power consumption.
4. Temperature Range: Designed for industrial temperature applications, it operates effectively in a wide temperature range, from -40°C to +95°C.
5. Package Type: The component is packaged in a compact 96-ball FBGA (Fine-pitch Ball Grid Array) format, making it suitable for high-density applications.
6. Performance and Reliability: Incorporates On-Die Termination (ODT) for improved signal integrity and reliability, essential for high-performance applications.
This combination of features makes it ideal for applications requiring robust and high-speed memory performance, such as in industrial, automotive, and telecom environments.
Pinout
The key functions of this memory component include supporting DDR4 SDRAM interface, providing high-speed performance, and being suitable for a wide range of applications such as computing, networking, and storage. The device also supports features like bank group architecture, which enhances data transfer efficiency, and on-die termination (ODT) for improved signal integrity.
This memory chip operates at a voltage of 1.2V and is designed for industrial temperature ranges, making it suitable for various environmental conditions. The combination of high capacity, speed, and reliability makes it an essential component in modern electronic systems.
Manufacturer
Application
1. Servers and Data Centers: Enhances performance and bandwidth.
2. Networking Equipment: Supports routers and switches with high data transfer rates.
3. Industrial Computers: Offers reliability in various industrial applications.
4. Telecommunications: Facilitates efficient data handling in telecommunications infrastructure.
5. Consumer Electronics: Boosts performance in gaming consoles and high-end computing devices.
6. Automotive Systems: Supports advanced infotainment and ADAS systems.
These applications benefit from its high capacity, speed, and low power consumption.