MT41K512M8DA-093:P

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MT41K512M8DA-093:P

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IC DRAM 4GBIT PAR 78FBGA

  • FabricanteMicron Technology Inc.

  • Peça do Fabricante #MT41K512M8DA-093:P

  • Em Estoque1734

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Especificações

Atributo Valor
Part Status Active
Base Product Number MT41K512M8
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 4Gbit
Memory Organization 512M x 8
Memory Interface Parallel
Clock Frequency 1.066 GHz
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 78-TFBGA
Supplier Device Package 78-FBGA (8x10.5)
Packaging Tray
Access Time 20 ns

Visão Geral

Description

The MT41K512M8DA-093:P is a high-speed, low-power DDR3L SDRAM chip manufactured by Micron Technology. It is organized as 512 Meg x 8 bits, totaling 4 gigabits (Gb) of memory capacity. This chip is designed for use in a wide range of computing applications, offering a balance of power efficiency and performance. It operates at a voltage of 1.35V, making it suitable for energy-sensitive applications.
With a data rate of up to 1866 MT/s (megatransfers per second), the MT41K512M8DA-093:P supports fast data processing. The ":P" suffix typically refers to the package type and specific features, such as temperature range or speed bin, ensuring compatibility with various system requirements. The chip's architecture supports features like fly-by command/address bus, on-die termination (ODT), and dynamic on/off-chip data bus inversion (DBI) to enhance signal integrity and efficiency.
This SDRAM is used in applications ranging from personal computers and laptops to servers and networking devices, where high-speed data access and reliability are paramount.

Equivalent

The MT41K512M8DA-093:P is a 4Gb DDR3L SDRAM chip from Micron. Equivalent products are typically other 4Gb DDR3L SDRAM chips with similar specifications. Examples include:
1. Samsung K4B4G0846D
2. Hynix H5TC4G83AFR
3. Kingston D3L4G08BAM
Ensure to verify specific details like voltage, speed, and package compatibility when considering alternatives.

Features

The MT41K512M8DA-093:P is a 4Gb DDR3L SDRAM, organized as 512M x 8. Key features include:
1. Low Voltage Operation: Operates at 1.35V (DDR3L) for reduced power consumption, with backward compatibility to 1.5V (DDR3).
2. High-Speed Data Transfer: Supports data rates up to 1866 MT/s for enhanced performance.
3. 8-Bit Prefetch Architecture: Offers improved efficiency in data access and throughput.
4. Multiple Bank Groups: Features 8 internal banks, allowing for concurrent operations and improved bandwidth.
5. Auto Refresh and Self Refresh: Includes mechanisms for maintaining data integrity and conserving power during idle periods.
6. Programmable Modes: Supports CAS latency, burst length, and other programmable features for flexible operation.
7. Temperature Sensor: Incorporates an on-die thermal sensor for better thermal management.
8. Package: Available in a 78-ball FBGA package that is compact for various applications.
These features make it suitable for a wide range of applications, including computing, networking, and consumer electronics.

Pinout

The MT41K512M8DA-093:P is a DDR3 SDRAM chip manufactured by Micron Technology. It has a pin count of 78. This chip is organized as 512 Megabits with an 8-bit I/O. The primary function of the MT41K512M8DA-093:P is to provide high-speed data storage and retrieval for computing systems. It operates at a supply voltage of 1.5V and is capable of data rates up to 1866 MT/s (megatransfers per second). This makes it suitable for applications requiring fast and efficient memory access, such as in personal computers, servers, and embedded systems. The chip supports various functions, including read and write operations, programmable burst lengths, and auto-refresh to maintain data integrity.

Manufacturer

The MT41K512M8DA-093:P is a DRAM chip manufactured by Micron Technology, Inc. Micron is an American company known for its role in the semiconductor industry. It specializes in the production of memory and storage solutions, including DRAM, NAND flash, and NOR flash products. Micron's products are widely used in various applications such as computing, networking, automotive, and mobile devices. The company is recognized as one of the leading memory manufacturers globally and is involved in the design, development, and production of advanced memory and storage technologies.

Application

The MT41K512M8DA-093:P is a DRAM chip commonly used in various applications that require high-speed data processing and storage. Its primary application areas include:
1. Computing Systems: Used in desktops, laptops, and servers for efficient memory management.
2. Mobile Devices: Powers smartphones and tablets, enabling multitasking and enhanced performance.
3. Networking Equipment: Supports routers and switches for handling large data transfers.
4. Consumer Electronics: Integrated into gaming consoles, smart TVs, and digital cameras.
5. Automotive Systems: Utilized in infotainment and advanced driver-assistance systems (ADAS).
6. Industrial Applications: Supports automation systems and IoT devices for real-time data processing.
These applications leverage the DRAM's speed, reliability, and efficient power consumption.

Package

The MT41K512M8DA-093:P is a DRAM chip from Micron Technology, and it typically comes in a FBGA (Fine-pitch Ball Grid Array) package type, which is compact and suitable for mounting on PCBs.

Frequently Asked Questions


Q: What is the memory density and organization of the MT41K512M8DA-093:P?
A: This is a 4Gbit DDR3L SDRAM, organized as 512M x 8 bits, suitable for high-density memory applications.


Q: What is the operating voltage range for this component?
A: It operates at a low voltage of 1.283V to 1.45V, making it ideal for power-sensitive designs.


Q: What is the maximum clock frequency and access time?
A: It supports a clock frequency of 1.066 GHz with an access time of 20 ns, ensuring fast data throughput.


Q: What is the operating temperature range for this DDR3L memory?
A: The component is rated for an operating temperature range of 0°C to 95°C (TC), suitable for commercial environments.


Q: What package does this memory use, and is it surface mount?
A: It comes in a 78-TFBGA package (78-FBGA, 8x10.5mm) and supports surface mount technology for compact PCB layouts.


Q: Is this component compatible with DDR3L low-voltage standards?
A: Yes, it uses SDRAM - DDR3L technology, designed for 1.35V operation to reduce power consumption compared to standard DDR3.


Q: What is the memory interface type for this device?
A: It uses a parallel memory interface, common for DRAM modules, ensuring wide compatibility with memory controllers.


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