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MT41K64M16TW-107 IT:J
+Lista de Materiais1.283V~1.45V 1Gbit 933MHz DDR3L SDRAM FBGA-96 Memory (ICs) RoHS
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FabricanteMicron
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Peça do Fabricante #MT41K64M16TW-107 IT:J
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Especificações
| Atributo | Valor |
| Packaging | FBGA-96 |
| Clock Frequency | 933MHz |
| Memory Format | DDR3L SDRAM |
| Memory Size | 1Gbit |
| Operating Temperature | -40℃~+95℃ |
| Voltage - Supply | 1.283V~1.45V |
Visão Geral
Description
Key features of the MT41K64M16TW-107 IT:J include a memory density of 1 gigabit (Gb), organized in a 64 Meg x 16 configuration. It operates with a clock frequency of 933 MHz (resulting in an effective data rate of 1866 MT/s), and a CAS latency of 10 cycles. The "IT" designation indicates industrial temperature range support, typically from -40°C to 95°C, ensuring reliability in various environments. The "J" suffix specifies the package type and form factor, which is often a standard JEDEC-compliant FBGA (Fine-pitch Ball Grid Array) package. This DRAM chip is commonly used in embedded systems, networking equipment, and industrial applications.
Equivalent
1. Hynix: H5TC4G63AFR series
2. Samsung: K4B4G1646E series
3. SK Hynix: H5TQ4G63AFR series
4. Nanya: NT5CB256M16BP series
5. Kingston: D2516EC4BXGGB series
These products are typically used interchangeably in applications requiring similar DDR3L specifications. Always confirm compatibility based on specific application requirements.
Features
1. Density and Organization: The chip has a density of 1Gb, organized as 64M x 16 bits.
2. Speed and Performance: Operates at a clock speed of 933 MHz, adhering to DDR3-1866 specifications, with a data transfer rate of up to 1866 MT/s.
3. Voltage: Functions at a voltage range of 1.5V ±0.075V.
4. Package Type: Comes in a 96-ball FBGA package.
5. Temperature Range: Designed for an industrial temperature range of -40°C to +95°C, suitable for demanding environments.
6. Low Power Features: Includes power-saving features such as partial array self-refresh (PASR) and programmable output drive strength.
7. Reliability Features: Supports on-die termination (ODT) and dynamic on-die termination (DODT) for improved signal integrity.
8. Compatibility: Conforms to the JEDEC standard, ensuring broad compatibility with DDR3 memory controllers.
This combination of features makes it suitable for a variety of high-performance applications in industrial and embedded systems.
Pinout
Key functions and features include:
- Data Width: 16 bits
- Density: 1 Gb
- Clock Speed: Up to 933 MHz (DDR3-1866)
- Timing: CAS Latency options ranging from CL=7 to CL=13
- Temperature Range: Industrial (-40°C to +95°C)
- Features: Support for on-die termination, dynamic on-chip thermal sensor, and auto-refresh technology.
The module is used in various applications, including computing, networking, and telecommunications, providing high-speed data storage and retrieval capabilities. Its low operating voltage and power-efficient design make it ideal for battery-powered and thermally constrained environments.
Manufacturer
Application
1. Consumer Electronics: Enhances performance in devices like smart TVs and set-top boxes.
2. Computing: Used in laptops, desktops, and servers to boost memory capacity and speed.
3. Networking Equipment: Supports routers, switches, and network interfaces in managing data flow.
4. Industrial Applications: Aids in automation systems and control units requiring reliable memory.
5. Automotive Systems: Utilized in infotainment systems and advanced driver-assistance systems (ADAS).
Its low power consumption and high data transfer rates make it suitable for energy-efficient and performance-critical applications.