Imagens apenas para referência
MT46H32M16LFBF-5 IT:C
+Lista de Materiais512Mbit 1.7V~1.95V 200MHz LPDDR SDRAM VFBGA-60(8x9) Memory (ICs) RoHS
-
FabricanteMicron
-
Peça do Fabricante #MT46H32M16LFBF-5 IT:C
-
Em Estoque18799
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Packaging | VFBGA-60(8x9) |
| Clock Frequency | 200MHz |
| Supply Current | 70mA |
| Memory Format | LPDDR SDRAM |
| Memory Size | 512Mbit |
| Operating Temperature | -40℃~+85℃ |
| Refresh Current | 2mA |
| Voltage - Supply | 1.7V~1.95V |
Visão Geral
Description
Equivalent
1. Samsung K4X51163PC series
2. Hynix H9TKNNN4GDM series
3. Nanya NT5CC128M16IP series
These products generally match similar specifications in terms of memory size, data rate, and operating temperature range. Always verify pin compatibility and electrical characteristics before considering replacements.
Features
1. Low Power Consumption: Designed for mobile applications, it supports deep power-down modes, partial array self-refresh, and temperature-compensated self-refresh to minimize energy usage.
2. High-Speed Performance: Operates with clock speeds up to 200 MHz (DDR400), providing high data transfer rates.
3. Temperature Range: IT:C specifies an industrial temperature range from -40°C to +85°C, suitable for diverse environmental conditions.
4. Package: Available in a compact FBGA package, which is optimal for space-constrained applications like mobile devices.
5. Power Supply: Operates at a low voltage of 1.8V, further contributing to energy efficiency.
6. Advanced Features: Includes on-chip temperature sensor and programmable output buffer drive strength to optimize performance.
These features make it suitable for use in smartphones, tablets, and other portable electronics, where power efficiency and performance are critical.
Pinout
The chip comes in a 60-ball FBGA (Fine Ball Grid Array) package, which means it has 60 pins or balls for connections. The primary function of this memory chip is to provide high-density, low-power memory for mobile applications, like smartphones and tablets. It operates with a voltage range suitable for mobile applications, ensuring efficient power consumption. The chip is organized as 32 Meg x 16, indicating it has a capacity of 512 Megabits.
Its primary use is to provide fast, efficient memory access to support the processing needs of mobile devices while maintaining battery life. It supports features typical of LPDDR memory, such as deep power-down modes and low self-refresh currents, to optimize power usage.