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MT47H64M16NF-25EIT:M
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FabricanteMicron Tech
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Peça do Fabricante #MT47H64M16NF-25EIT:M
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Especificações
| Atributo | Valor |
| Manufacturer | Micron Tech |
| Package | FBGA-84 |
Visão Geral
Description
Key features include a 1.5V operating voltage, which enhances energy efficiency, and a standard 78-ball FBGA package for compact integration on PCBs. This chip is widely used in consumer electronics, including laptops and smartphones, for tasks requiring high-speed data processing and storage. Its compatibility with DDR3 architecture also allows for seamless integration in various electronic systems.
Equivalent
1. Hynix H5TQ2G83AFR - DDR3 2GB
2. Micron MT41J128M16HA - DDR3 2GB
3. Samsung K4B4G1646F - DDR3 2GB
Ensure compatibility in terms of specifications and operating voltage when considering replacements.
Features
1. Capacity: 1 gigabit (Gb) per chip, organized as 64 megabytes (MB) x 16 bits.
2. Speed: Operates at a maximum data rate of 1600 MT/s (million transfers per second).
3. Process Technology: Built on a 25nm process technology, enhancing power efficiency and performance.
4. Voltage: Operates at a low voltage of 1.5V, which helps to reduce power consumption.
5. Interface: Supports a 16-bit data bus for high-speed data access.
6. Packages: Available in a fine-pitch ball grid array (FBGA) package for efficient space utilization on PCBs.
7. Applications: Commonly used in computing, networking, and embedded systems where high-speed memory is required.
This memory chip is designed for high-performance applications, providing a balance of speed, efficiency, and density.
Pinout
Key functions of this memory chip include:
- Data Storage: It stores data in a 64-bit wide format, enabling efficient transfer with 16 bits per data line.
- Speed: The "-25" in the part number indicates a maximum clock speed of 800 MT/s (megatransfers per second).
- Voltage: It operates at a nominal voltage of 1.5V, making it suitable for power-sensitive applications.
- Refresh Operations: It supports standard DRAM refresh operations to maintain data integrity.
- Common I/O: The design supports common I/O for enabling simultaneous read/write operations.
This memory chip is commonly used in various applications, including computers, networking equipment, and consumer electronics.
Manufacturer
The company serves a wide range of markets, including computing, consumer electronics, automotive, and cloud computing, providing essential memory products for various applications. Micron is known for its innovation and technology advancements in semiconductor manufacturing, playing a significant role in the evolution of memory technologies.
Micron operates globally, with manufacturing facilities, research and development centers, and sales offices in numerous countries. Its commitment to quality and performance has made it a key player in the semiconductor industry, contributing significantly to advancements in data storage and memory solutions.
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of the MT47H64M16NF-25EIT:M?
A: It is a 1Gb (64M x 16) DDR2 SDRAM, organized as 64 million words by 16 bits.
Q: What is the maximum clock frequency supported by this device?
A: With a speed grade of -25E, it supports a maximum clock frequency of 400 MHz (DDR2-800).
Q: What temperature range does the "IT" in the suffix indicate for operation?
A: It indicates an industrial temperature range, typically from -40°C to +95°C case temperature (Tcase).
Q: What package type does this Micron DDR2 memory use?
A: It is housed in an FBGA-84 (Fine-Pitch Ball Grid Array, 84-ball) package.
Q: What is the typical application for the MT47H64M16NF-25EIT:M?
A: It is commonly used in embedded systems, networking equipment, and industrial computing requiring robust DDR2 memory.
Q: Is this component RoHS compliant or lead-free?
A: Based on the provided parameters, RoHS compliance is not specified; please verify with the specific date code or manufacturer datasheet.