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MTFC32GBCAQTC-WT
+Lista de MateriaisEMMC 256GBIT 153/196 LFBGA WT
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FabricanteMicron Technology Inc.
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Peça do Fabricante #MTFC32GBCAQTC-WT
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Especificações
| Atributo | Valor |
| Series | e•MMC™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 256Gbit |
| Memory Organization | 32G x 8 |
| Memory Interface | eMMC_5.1 |
| Clock Frequency | 200 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -25°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package | 153-LFBGA |
| Supplier Device Package | 153-LFBGA (11.5x13) |
| Packaging | Bulk |
Visão Geral
Description
MTFC32GBCAQTC-WT looks like a part number for a 32 GB flash memory device. Without the vendor or datasheet, I can only give a generic intro: it’s a non-volatile storage component used in embedded systems to hold firmware and data. Typical specs to confirm are memory type (NAND vs NOR), interface (SPI, ONFi, SATA, etc.), operating voltage, endurance, read/write speeds, package type, and temperature rating (WT often suggests a wide-temperature variant). For an accurate introduction, please share the manufacturer or a datasheet link.
Manufacturer
Manufacturer: Micron Technology, Inc.
What kind of company: A U.S.-based multinational semiconductor company that designs and manufactures memory and storage technologies, including DRAM, NAND/NOR flash, and SSDs. They are one of the largest memory chip producers worldwide.
What kind of company: A U.S.-based multinational semiconductor company that designs and manufactures memory and storage technologies, including DRAM, NAND/NOR flash, and SSDs. They are one of the largest memory chip producers worldwide.
Application
Typically used as onboard nonvolatile storage in systems needing compact capacity and rugged operation:
- Embedded devices (MCUs/SoCs) requiring firmware and data storage
- Automotive (infotainment, instrument clusters, telematics)
- Industrial automation and control systems
- Consumer electronics (set-top boxes, streaming devices, cameras)
- Networking/telecom equipment (routers, gateways, APs)
- IoT edge devices and gateways
- Digital signage and surveillance systems
- Medical devices for firmware/data logging (noncritical)
Note: Refer to the official datasheet for interface, endurance and temperature specifications.
- Embedded devices (MCUs/SoCs) requiring firmware and data storage
- Automotive (infotainment, instrument clusters, telematics)
- Industrial automation and control systems
- Consumer electronics (set-top boxes, streaming devices, cameras)
- Networking/telecom equipment (routers, gateways, APs)
- IoT edge devices and gateways
- Digital signage and surveillance systems
- Medical devices for firmware/data logging (noncritical)
Note: Refer to the official datasheet for interface, endurance and temperature specifications.
Package
Package type: BGA (Ball Grid Array). For exact ball count and footprint, consult the manufacturer’s MTFC32GBCAQTC-WT datasheet.
