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MW7IC2220NR1
+Lista de MateriaisIC AMP CDMA 2.11-2.17GHZ TO270
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FabricanteNXP USA Inc.
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Peça do Fabricante #MW7IC2220NR1
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Ficha Técnica MW7IC2220NR1 DataSheet
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Pacote TO-270-16
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Especificações
| Atributo | Valor |
| Supplier | Flip Electronics,NXP USA Inc. |
| Package | Tape & Reel (TR),Tape & Reel (TR) |
| ProductStatus | Obsolete |
| Frequency | 2.11GHz ~ 2.17GHz |
| P1dB | 43dBm |
| Gain | 31dB |
| RFType | W-CDMA |
| Voltage-Supply | 28V |
| Current-Supply | 300mA |
| TestFrequency | 2.14GHz |
| MountingType | Chassis Mount |
| Package/Case | TO-270-16 Variant, Flat Leads |
Visão Geral
Description
The MW7IC2220NR1 features an integrated input matching network, which simplifies circuit design and improves user convenience. It also offers a high output power capability and operates at a supply voltage of 28 volts. The transistor is housed in a compact, thermally enhanced package, promoting effective heat dissipation and enabling high power density applications.
Overall, the MW7IC2220NR1 is ideal for use in 3G/4G wireless infrastructure, including applications like LTE and WCDMA, providing robust performance and durability for demanding RF environments.
Equivalent
1. NXP's AFT27S006N: Similar power and frequency range for RF applications.
2. Ampleon’s BLF7G22LS-160: Designed for similar frequency bands with comparable power levels.
3. Qorvo's T1G2028536-FL: Offers similar performance for RF and microwave applications.
Ensure compatibility with your specific application requirements before substituting.
Features
1. Frequency Range: Operates efficiently within the 2110 MHz to 2170 MHz frequency range, making it suitable for 3G and 4G base station applications.
2. High Output Power: Capable of delivering up to 40 watts of power output, supporting high-efficiency operation.
3. Technology: Utilizes advanced LDMOS (Laterally Diffused Metal Oxide Semiconductor) technology for improved performance and reliability.
4. Efficiency: Offers high efficiency, reducing power consumption and heat generation, which is critical for maintaining system performance and longevity.
5. Package: Available in a surface-mount package, facilitating easier integration into compact designs.
6. Thermal Management: Equipped with features to handle thermal dissipation, ensuring stability even under high-power conditions.
7. Robustness: Designed to withstand rugged environmental conditions, including high temperature and voltage variations, enhancing device reliability.
These features make the MW7IC2220NR1 ideal for use in modern wireless infrastructure, providing a balance of power, efficiency, and integration flexibility.
Pinout
Key functions of the MW7IC2220NR1 include high gain and high efficiency in RF amplification. It delivers a high output power capability, making it suitable for use in high-performance RF power amplifiers. The device is designed to provide excellent thermal performance and reliability, critical for maintaining performance and durability in demanding environments. Its high ruggedness and efficiency make it a popular choice for telecommunications infrastructure, particularly in applications needing a high degree of linearity and power output.