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MX60LF8G18AC-XKI
+Lista de MateriaisIC FLASH 8GBIT PARALLEL 63VFBGA
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FabricanteMacronix
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Peça do Fabricante #MX60LF8G18AC-XKI
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Ficha Técnica MX60LF8G18AC-XKI DataSheet
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Especificações
| Atributo | Valor |
| Series | MX60LF |
| Part Status | Not For New Designs |
| Base Product Number | MX60LF8 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 8Gbit |
| Memory Organization | 1G x 8 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 20ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (9x11) |
| Packaging | Tray |
| Access Time | 20 ns |
Visão Geral
Description
Key features include high endurance and reliability, thanks to advanced error correction code (ECC) capabilities, making it suitable for applications requiring robust data retention. The MX60LF8G18AC-XKI operates within a wide temperature range, supporting use in various environmental conditions. It also features a small form factor which aids in compact device designs.
The chip follows industry standards for NAND Flash memory, ensuring compatibility with a broad range of controllers and systems. It's typically used in applications that demand high-density data storage, such as solid-state drives, multimedia devices, and embedded systems. Overall, the MX60LF8G18AC-XKI combines high performance with reliability, catering to the growing demands for efficient memory solutions in modern electronics.
Equivalent
1. Samsung: K9GAG08U0F
2. Micron: MT29F8G08ABABA
3. SK Hynix: H27UAG8T2BTR
4. Toshiba (Kioxia): TC58NVG6DCJTA00
It's important to verify compatibility in terms of package, interface, and performance specifications before substitution.
Features
1. Capacity: 8 Gbit (1 GB) organized in a x8 interface.
2. Type: SLC (Single Level Cell) NAND Flash, known for higher endurance and reliability compared to MLC/TLC NAND.
3. Voltage: Operates at a core voltage of 3.3V.
4. Performance: Fast read and write speeds, suitable for high-performance applications.
5. Endurance: Enhanced endurance and data retention characteristics, typically with higher program/erase cycles.
6. Interface: Features a standard NAND interface, compatible with a wide range of controllers.
7. Package: Available in TSOP and other standard packages, suitable for various design requirements.
8. Temperature Range: Supports a wide operating temperature range, making it suitable for industrial applications.
9. Error Correction: Built-in ECC (Error Correction Code) capabilities for data integrity.
10. Applications: Ideal for use in embedded systems, consumer electronics, and industrial devices requiring reliable non-volatile storage.
These features make it suitable for applications demanding high reliability and performance.
Pinout
- Data I/O (DQ): These pins are used for data input and output.
- Address (A): These pins are used to specify the memory address for data read/write operations.
- Control Signals: These include pins for Write Enable (WE#), Read Enable (RE#), Chip Enable (CE#), and Command Latch Enable (CLE).
- Power Supply: These pins provide the necessary power (VCC) and ground (GND) connections.
- Other Functions: Additional pins may be present for Reset (RESET#) and spare functions like Spare Area Enable (SAE).
The exact pin configuration and specific functions can be verified by consulting the datasheet or technical documentation provided by Macronix for this specific part.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory technology and configuration of MX60LF8G18AC-XKI?
A: It is a Non-Volatile SLC NAND Flash with 8Gbit density, organized as 1G x 8 bits, using a Parallel memory interface.
Q: What voltage range does this NAND Flash support?
A: The device operates with a supply voltage between 2.7V and 3.6V, making it suitable for standard 3.3V systems.
Q: What is the operating temperature range and package type?
A: It supports industrial temperature from -40°C to 85°C, housed in a surface-mount 63-VFBGA (9x11mm) package.
Q: What is the typical access and write cycle time?
A: The access time is 20 ns, and the write cycle time (word/page) is also 20 ns, enabling fast read and program operations.
Q: Is this part recommended for new designs?
A: No, its Part Status is "Not For New Designs," implying it may be phased out; consider newer alternatives in the MX60LF series.
Q: What is the packaging format for this component?
A: It is supplied in Tray packaging, ideal for automated assembly lines and prototyping environments.