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N25Q256A11ESF40F
+Lista de Materiais1.7V~2V 256Mbit 108MHz SPI SOP-162 Memory (ICs) RoHS
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FabricanteMicron
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Peça do Fabricante #N25Q256A11ESF40F
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Em Estoque5696
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Especificações
| Atributo | Valor |
| Packaging | SOP-162 |
| ClockFrequency | 108MHz |
| Interface | SPI |
| MemorySize | 256Mbit |
| Operatingtemperature | -40℃~+85℃ |
| Voltage-Supply | 1.7V~2V |
| DataRetention-TDR(Year) | 20 Years |
| Program/EraseCycles | 100,000 cycles |
Visão Geral
Description
The device supports dual and quad I/O operations, enabling higher data throughput, and is equipped with security features like hardware-based write protection and a 64-bit unique device identifier for enhanced data integrity and protection. The N25Q256A11ESF40F is also noted for its endurance and reliability, with the ability to handle numerous program/erase cycles, making it suitable for applications requiring frequent data updates. Its compact package and low power consumption further enhance its applicability in space-constrained and battery-operated devices.
Equivalent
1. Winbond W25Q256FV - Offers similar capacity and interface.
2. Macronix MX25L25635F - Another 256Mb serial NOR flash with similar features.
3. Spansion/Cypress S25FL256S - Offers comparable performance and capacity.
These alternatives provide similar specifications such as storage capacity, interface type (SPI), and operational temperature range, making them suitable replacements for the N25Q256A11ESF40F.
Features
Key features include:
1. High Performance: Offers fast read speeds and efficient program and erase operations.
2. Uniform Sector Architecture: Consists of uniform 4KB sectors, 64KB blocks, and a top or bottom 256KB parameter block.
3. Security: Includes a 256-byte one-time programmable (OTP) area and a 64-byte unique identifier for enhanced security.
4. Reliability: Endures up to 100,000 program/erase cycles per sector and retains data for up to 20 years.
5. Low Power Consumption: Designed for low-power applications, featuring deep power-down and standby modes.
6. Temperature Range: Supports a wide temperature range from -40°C to +85°C.
This flash memory is suitable for applications requiring high-speed data access, robust security features, and reliable data storage.
Pinout
1. CS# (Chip Select): Activates the device when it is low, enabling data transfer.
2. SCK (Serial Clock): Provides the clock signal to synchronize data transfers.
3. DQ0 (MOSI - Master Out, Slave In): Serial data input.
4. DQ1 (MISO - Master In, Slave Out): Serial data output.
5. DQ2: Used for Dual and Quad SPI operations.
6. DQ3: Used for Dual and Quad SPI operations.
7. VCC: Power supply pin.
8. VSS (GND): Ground reference for the power supply.
The N25Q256A11ESF40F supports standard SPI, Dual SPI, and Quad SPI, allowing for faster data transfer rates. It is used in applications requiring non-volatile storage such as firmware storage in embedded systems.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the maximum clock frequency supported by this SPI NOR flash?
A: The N25Q256A11ESF40F supports a maximum clock frequency of 108MHz for high-speed read operations.
Q: What is the operating temperature range for this memory chip?
A: It operates reliably across an industrial temperature range of -40°C to +85°C.
Q: What voltage supply does this component require?
A: It requires a supply voltage between 1.7V and 2V, making it suitable for low-power designs.
Q: How many program/erase cycles can this device endure?
A: It offers 100,000 program/erase cycles, ensuring high endurance for frequent data updates.
Q: What is the data retention period of this N25Q256A device?
A: It guarantees a data retention time of 20 years under normal operating conditions.
Q: What interface protocol does this memory use?
A: It uses the standard SPI (Serial Peripheral Interface) protocol for communication.
Q: What is the memory density of this component?
A: It provides a memory size of 256Mbits, ideal for code shadowing and data storage applications.
Q: What is the physical packaging of this part?
A: It comes in a SOP-162 (Small Outline Package) form factor for easy surface-mount assembly.