NAND01GR3B2CZA6E

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NAND01GR3B2CZA6E

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IC FLASH 1GBIT PARALLEL 63VFBGA

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Especificações

Atributo Valor
Part Status Obsolete
Base Product Number NAND01
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 25ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 63-TFBGA
Supplier Device Package 63-VFBGA (9.5x12)
Packaging Tray
Access Time 25 ns

Visão Geral

Description

The NAND01GR3B2CZA6E is a 1 Gb (Gigabit) NAND flash memory chip produced by Micron Technology. It is designed for applications requiring non-volatile storage with high performance and reliability. This device utilizes a NAND architecture, which allows for efficient data storage and retrieval, making it suitable for a variety of consumer electronics, including smartphones, tablets, and embedded systems.
The chip features a Serial Peripheral Interface (SPI) for easy integration into systems, enabling faster access times and lower power consumption. It supports various operating modes and has a built-in error correction code (ECC) to enhance data integrity. The NAND01GR3B2CZA6E is available in different package options, allowing flexibility for various design requirements.
With its high density and compact size, this NAND flash memory is an excellent solution for applications needing reliable storage, such as firmware, boot code, and user data. Its performance characteristics make it ideal for both industrial and consumer applications.

Equivalent

The NAND01GR3B2CZA6E chip is a 1 Gb NAND Flash memory from Micron. Equivalent products include the STMicroelectronics M45PE10, the Winbond W25N01GV, and the Toshiba TC58NVG0S3H1. When selecting equivalents, ensure compatibility with specifications like voltage, interface, and package type. Always consult the manufacturer's datasheets for detailed comparisons.

Features

The NAND01GR3B2CZA6E is a 1 Gb (Gigabit) NAND flash memory chip produced by ON Semiconductor. Key features include:
1. Density: 1 Gb storage capacity.
2. Interface: Serial Peripheral Interface (SPI), facilitating easy integration with microcontrollers and other devices.
3. Voltage Range: Operates between 2.7V and 3.6V, making it suitable for various low-power applications.
4. Program/Erase Cycles: Supports 100,000 program/erase cycles, ensuring durability and longevity.
5. Data Retention: Retains data for up to 10 years at 55°C.
6. Access Speed: Offers fast read access times, typically around 25 ns.
7. Page Size: 2 KB page size with a block size of 128 KB, allowing efficient data management.
8. Temperature Range: Supports industrial temperature range, ideal for demanding applications.
This NAND flash memory is widely used in consumer electronics, automotive, and industrial applications for reliable data storage.

Pinout

The NAND01GR3B2CZA6E is a 1 Gigabit (128MB) NAND Flash memory device. It features a total of 48 pins. The pin functions include:
1. Input/Output Pins (I/O): Used for data transfer (I/O0 to I/O7).
2. Command and Address Pins: For sending commands and addresses (A0 to A23).
3. Chip Enable (CE): Activates the chip.
4. Write Enable (WE): Controls write operations.
5. Read Enable (RE): Controls read operations.
6. Ready/Busy (R/B): Indicates the device status.
7. Reset (RESET): Resets the device.
8. VCC: Power supply.
9. VSS: Ground connection.
This device primarily serves applications in mobile and embedded systems for data storage.

Manufacturer

The NAND01GR3B2CZA6E is manufactured by STMicroelectronics. STMicroelectronics is a global leader in semiconductor solutions, specializing in a wide range of products including microcontrollers, sensors, power management ICs, and memory devices. Founded in 1987 through the merger of SGS Microelettronica and Thomson Semiconducteurs, the company is headquartered in Geneva, Switzerland.
The firm operates in various sectors such as automotive, industrial, consumer electronics, and communication, providing innovative solutions for a diverse range of applications. STMicroelectronics is known for its strong focus on research and development, contributing to advancements in technology and offering products that enhance energy efficiency, connectivity, and performance. Their NAND flash memory products, like the NAND01GR3B2CZA6E, are widely used in mobile devices, automotive systems, and embedded applications, underscoring the company's role in powering modern electronic devices.

Application

The NAND01GR3B2CZA6E is a 1GB NAND flash memory chip primarily used in various applications such as mobile devices, consumer electronics, and embedded systems. Its compact size and low power consumption make it ideal for smartphones, tablets, and portable media players. Additionally, it is utilized in automotive electronics, industrial applications, and IoT devices for data storage and firmware updates. The chip’s reliability and performance also support applications in digital cameras and wearables, where efficient data storage is critical.

Package

The NAND01GR3B2CZA6E is packaged in a TSOP (Thin Small Outline Package) type, specifically TSOP-48. This package is designed for surface mounting and is commonly used in electronic devices for NAND flash memory applications.

Frequently Asked Questions


Q: What is the memory size and organization of the NAND01GR3B2CZA6E?
A: It is a 1Gbit NAND Flash memory organized as 128M x 8 bits, suitable for high-density data storage.


Q: What is the supply voltage range for this device?
A: It operates with a low supply voltage range of 1.7V to 1.95V, ideal for power-sensitive applications.


Q: What is the access time and write cycle time?
A: The access time is 25 ns, and the write cycle time per word/page is also 25 ns, ensuring fast read/write performance.


Q: Can this component operate in extreme temperatures?
A: Yes, it has an industrial temperature range from -40°C to 85°C (TA), suitable for harsh environments.


Q: What package type does the NAND01GR3B2CZA6E use?
A: It comes in a 63-TFBGA package (63-VFBGA 9.5x12), designed for surface mount assembly in compact designs.


Q: What is the memory interface of this NAND Flash?
A: It uses a parallel memory interface, which provides straightforward integration with legacy or custom controllers.


Q: Is this part currently in production or obsolete?
A: The part status is marked as Obsolete, so it may be end-of-life. Verify availability or consider alternatives for new designs.


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