NRF5340-QKAA-R7

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NRF5340-QKAA-R7

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IC RF TXRX+MCU 802.15.4 94QFN

  • FabricanteSemicondutor Nórdico ASA

  • Peça do Fabricante #NRF5340-QKAA-R7

  • Em Estoque3390

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Especificações

Atributo Valor
Series nRF53
Part Status Active
Base Product Number NRF5340
Digi Key Programmable Not Verified
Type TxRx + MCU
RF Family / Standard 802.15.4, Bluetooth
Protocol Bluetooth v5.1, Thread, Zigbee®
Frequency 2.4GHz
Data Rate (Max) 2Mbps
Power - Output 3dBm
Sensitivity -97.5dBm
Memory Size 1MB Flash, 256kB RAM
Serial Interfaces ADC, I2S, PWM, SPI, UART, USB
Voltage - Supply 1.7V ~ 5.5V
Current - Receiving 2.6mA ~ 7mA
Current - Transmitting 3.2mA
Operating Temperature -40°C ~ 105°C
Mounting Type Surface Mount
Package / Case 94-VFQFN Dual Rows, Exposed Pad
Supplier Device Package 94-aQFN (7x7)
Packaging Cut Tape (CT), Tape & Reel (TR)
GPIO 48

Visão Geral

Description

The NRF5340-QKAA-R7 is a cutting-edge System-on-Chip (SoC) from Nordic Semiconductor, designed primarily for advanced Bluetooth Low Energy (BLE) applications, as well as other wireless protocols. This SoC is part of the nRF53 series and is notable for its dual-core architecture. It features a high-performance 128 MHz Arm Cortex-M33 application processor and a 64 MHz network processor, optimized for handling complex, power-efficient IoT tasks.
The NRF5340-QKAA-R7 supports Bluetooth 5.2, including features like LE Audio, Long Range, and Direction Finding. In addition to BLE, it is compatible with IEEE 802.15.4, NFC, and other proprietary protocols, making it highly versatile for various connectivity solutions.
With its low power consumption, integrated security features, such as Arm TrustZone and CryptoCell 312, and extensive interface support, the NRF5340-QKAA-R7 is ideal for applications in smart home, wearable tech, medical devices, and industrial IoT. It also benefits from Nordic's robust software development kit (SDK), providing developers with comprehensive tools and libraries for efficient development.

Equivalent

The Nordic Semiconductor NRF5340-QKAA-R7 chip is a dual-core Bluetooth 5.2 SoC. Equivalent products include:
1. Dialog Semiconductor DA1469x Series: Offers advanced Bluetooth features with dual-core architecture.
2. Silicon Labs EFR32BG22: Provides Bluetooth 5.2 support with efficient power management.
3. Texas Instruments CC2652R: Supports Bluetooth 5 and offers dual-core processing capabilities.
4. NXP KW38: A multi-protocol wireless MCU supporting Bluetooth 5 and optimized for low power consumption.

Features

The NRF5340-QKAA-R7 is a dual-core wireless System on Chip (SoC) by Nordic Semiconductor, part of their nRF53 series. Key features include:
1. Dual-Core Architecture: It has an Arm Cortex-M33 high-performance application processor and an Arm Cortex-M33 network processor, allowing efficient separation of application and protocol tasks.
2. Wireless Connectivity: Supports Bluetooth 5.2, Bluetooth Low Energy (LE) audio, Bluetooth mesh, NFC, IEEE 802.15.4 (for Zigbee and Thread), and other proprietary 2.4 GHz protocols.
3. Memory: Includes 512 KB RAM and 1 MB flash memory, providing ample space for complex applications.
4. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
5. Security Features: Comes with Arm TrustZone technology, an AES-128 accelerator, and a true random number generator for enhanced security.
6. Advanced Peripherals: Features like USB, QSPI, and high-speed SPI/I2C interfaces support versatile connectivity options.
7. Development Support: Compatible with Nordic’s software development kit (SDK), ensuring robust support for developers.
These features make the NRF5340-QKAA-R7 ideal for advanced IoT applications requiring high performance, security, and energy efficiency.

Pinout

The NRF5340-QKAA-R7 is a dual-core wireless System on Chip (SoC) from Nordic Semiconductor. It features a primary application processor and a network processor. The chip is housed in a 7x7 mm QFN package with 73 pins.
Key functions include support for Bluetooth 5.2, Bluetooth Low Energy, and other protocols like NFC, Zigbee, and Thread. It is designed for complex IoT applications, offering advanced security features, low power consumption, and ample processing power. The application processor is based on an Arm Cortex-M33 CPU, whereas the network processor is also based on a Cortex-M33 but is optimized for low-power operation. Additionally, the SoC includes a range of peripherals and interfaces, such as GPIOs, SPI, I2C, UART, ADC, and PWM, providing flexibility for various applications.

Manufacturer

The NRF5340-QKAA-R7 is manufactured by Nordic Semiconductor. Nordic Semiconductor is a Norwegian company that specializes in the design and production of semiconductor devices, particularly focusing on wireless communication solutions. They are known for their expertise in Bluetooth Low Energy (BLE) technology, as well as other wireless technologies such as cellular IoT, Zigbee, and Thread. The company provides integrated circuits (ICs) and software for a wide range of applications, including consumer electronics, wearable devices, healthcare, smart home, and industrial automation. Nordic Semiconductor is a publicly traded company and has established itself as a leader in the low-power wireless communication sector.

Application

The NRF5340-QKAA-R7 is a versatile SoC designed for advanced Bluetooth Low Energy applications. Its application areas include:
1. IoT Devices: Smart home products, wearables, and industrial IoT solutions.
2. Healthcare: Medical devices and fitness trackers.
3. Consumer Electronics: Audio devices, gaming peripherals, and smart remotes.
4. Automotive: In-car connectivity and smart key systems.
5. Industrial: Asset tracking and smart lighting systems.
6. Retail: Beacons and point-of-sale systems.
With its dual-core architecture, it supports complex applications requiring robust processing and low power consumption.

Package

The NRF5340-QKAA-R7 is a System-on-Chip (SoC) package from Nordic Semiconductor. It is housed in a QFN (Quad Flat No-leads) package type, specifically designed for high-performance wireless applications. The package typically provides efficient heat dissipation and compact form factor, suitable for integration in various IoT devices.

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