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NT5CC128M16JR-EK
+Lista de Materiais1.35V 2Gbit 933MHz DDR3 SDRAM TFBGA-96 Memory (ICs) RoHS
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FabricanteNanya Tech
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Peça do Fabricante #NT5CC128M16JR-EK
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Ficha Técnica NT5CC128M16JR-EK DataSheet
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Especificações
| Atributo | Valor |
| Packaging | TFBGA-96 |
| Clock Frequency | 933MHz |
| Memory Format | DDR3 SDRAM |
| Memory Size | 2Gbit |
| Operating temperature | 0℃~+95℃ |
| Voltage - Supply | 1.35V |
Visão Geral
Description
The "DDR3L" specification means it operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), making it more energy-efficient. This feature is particularly beneficial for portable devices and energy-conscious applications. The chip typically supports various clock speeds, providing flexibility in performance tuning.
In terms of packaging, the NT5CC128M16JR-EK is often available in a compact and reliable BGA (Ball Grid Array) package, which facilitates efficient heat dissipation and integration into circuit boards. Overall, the NT5CC128M16JR-EK is designed for applications requiring reliable, high-speed, and energy-efficient memory solutions.
Equivalent
1. Micron: MT41K128M16JT-125 or MT41K128M16HA-125
2. Samsung: K4B1G1646G-BCK0 or K4B1G1646F-BCMA
3. Hynix: H5TQ2G83DFR-PBC or H5TQ2G83CFR-PBC
4. Elpida: EDJ2116EBBG-GN-F
These equivalents should have similar configurations and performance characteristics, but always verify compatibility with specific application requirements.
Features
1. Memory Size: It offers a capacity of 2 Gb (gigabits), organized as 128M x 16.
2. Data Rate: Supports data rates up to 1600 Mbps, ideal for high-performance applications.
3. Voltage: Operates at a low voltage of 1.35V, with backward compatibility to 1.5V, enhancing power efficiency.
4. Package: Available in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package, which is compact and suitable for space-constrained applications.
5. Temperature Range: Supports an industrial temperature range from -40°C to 95°C, making it suitable for a variety of environments.
6. Compatibility: Compliant with the DDR3L standard, ensuring compatibility with a wide range of systems and devices.
7. Error Correction: Supports on-chip ECC (Error Correction Code) to enhance data integrity.
8. Low Power Consumption: Designed to reduce power usage, essential for battery-powered devices.
These features make it suitable for use in consumer electronics, computing, and industrial applications demanding efficient and reliable memory solutions.
Pinout
The functions of the pins in this type of chip generally include:
- Power Supply Pins: VDD, VDDQ for core and I/O power, respectively.
- Ground Pins: VSS, VSSQ for core and I/O ground.
- Address Pins: Used to specify the memory address for read/write operations.
- Control Pins: Including CS (Chip Select), RAS (Row Address Strobe), CAS (Column Address Strobe), and WE (Write Enable).
- Data Pins: DQ pins for data input/output.
- Clock Pins: CK, CK# for differential clock signal inputs.
- Other Pins: Such as CKE (Clock Enable), ODT (On-Die Termination), and various others for command and configuration purposes.
This concise overview captures the essential pin count and function of the NT5CC128M16JR-EK DDR3L SDRAM chip.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of the NT5CC128M16JR-EK?
A: It is a 2Gbit DDR3 SDRAM organized as 128M x 16 bits, suitable for high-bandwidth applications.
Q: What operating voltage does this DDR3 memory require?
A: It operates at a low 1.35V supply voltage (DDR3L standard), enabling reduced power consumption for mobile and embedded designs.
Q: What is the maximum clock frequency and data rate supported?
A: It supports a clock frequency of 933MHz, resulting in an effective data rate of 1866Mbps per pin.
Q: Can the NT5CC128M16JR-EK withstand the commercial temperature range?
A: Yes, its operating temperature range is 0°C to +95°C, making it suitable for typical commercial and industrial environments.
Q: What package type does this component use?
A: It is housed in a TFBGA-96 package (Thin Fine-Pitch Ball Grid Array), ideal for space-constrained PCB layouts.
Q: Is this memory compatible with standard DDR3 slots?
A: No, it is designed for surface-mount soldering on a PCB, not for DIMM sockets. It is intended for embedded or memory-down designs.
Q: What are typical applications for this Nanya DDR3L SDRAM?
A: It is widely used in networking equipment, SSDs, set-top boxes, routers, and other low-power embedded systems requiring 2Gb density.