RS512M32LO4D1BDS-53BT

The RS512M32LO4D1BDS-53BT is a 512MB DDR3 SDRAM (Synchronous Dynamic Random Access Memory) module, designed for high-performance computing applications. It operates at a voltage of 1.5V and features data rates up to 1066 MT/s (million transfers per second), making it suitable for various tasks requiring efficient memory performance.
This module typically comes in a SO-DIMM (Small Outline Dual In-Line Memory Module) form factor, which is ideal for laptops and compact devices. The memory is organized in a 32-bit wide interface, allowing for fast data transfer and enhanced system responsiveness.
With its low power consumption and enhanced thermal performance, the RS512M32LO4D1BDS-53BT is particularly useful in mobile and embedded systems, offering a balance between speed and efficiency. Overall, it serves as a reliable solution for applications that demand compact, high-speed memory.

The RS512M32LO4D1BDS-53BT chip is a 512 MB DDR2 SDRAM memory chip. Equivalent products include:
1. MT47H64M16 (Micron)
2. K4T1G164QE (Samsung)
3. Hynix HMT325S6CFR6C-PB (Hynix)
Ensure compatibility with your specific application as timing and voltage specifications may vary.

The RS512M32LO4D1BDS-53BT is a high-performance memory module featuring 512MB of DDR2 SDRAM with a 32-bit data width. Key features include:
- Speed: Operates at a clock frequency of 533 MHz, ensuring efficient data transfer rates.
- Memory Type: DDR2 (Double Data Rate 2), providing improved bandwidth and reduced power consumption compared to earlier DDR technologies.
- Form Factor: Typically in SO-DIMM (Small Outline Dual In-line Memory Module) configuration, suitable for laptops and compact systems.
- Voltage: Operates at a low voltage of 1.8V, contributing to energy efficiency.
- Latency: CL (CAS Latency) typically around 5, balancing speed and access times.
Its compact design and efficient performance make it ideal for various applications, including embedded systems and portable devices that require reliable memory solutions.

The RS512M32LO4D1BDS-53BT is a 512 Mbit (64 MB) DDR3 SDRAM memory chip. It typically has a pin count of 78 pins in a TSOP (Thin Small Outline Package) configuration.
The primary function of this memory device is to serve as volatile RAM for various electronic applications, including computers, mobile devices, and embedded systems. It operates at a clock frequency that can support data rates up to 1066 Mbps and is designed for high-speed data access. The device uses a 32-bit data bus and features various pins for power supply, ground, data input/output, chip select, and other control signals essential for operation and interfacing with a memory controller.

The RS512M32LO4D1BDS-53BT is manufactured by Rambus Inc. Rambus is a semiconductor and IP company that specializes in high-speed memory and interface technologies. Founded in 1990, Rambus initially gained prominence for its work on memory architecture and has since diversified into various areas, including security technology for electronics and innovations in data center and cloud infrastructure. The company's products and technologies are utilized in a range of applications, from consumer electronics to enterprise solutions, highlighting its role in the evolving landscape of digital technology. Rambus focuses on delivering high-performance solutions that enable faster and more efficient processing of data.

The RS512M32LO4D1BDS-53BT is a 512Mb (64MB) DDR2 SDRAM memory chip primarily used in embedded systems, telecommunications, automotive applications, and industrial control systems. Its applications include data buffering, caching, and enhancing processing capabilities in devices such as routers, switches, and various consumer electronics. The chip's low power consumption and high speed make it suitable for mobile devices and portable electronics, ensuring efficient performance in memory-intensive tasks. Additionally, it can be utilized in gaming consoles and multimedia devices for improved graphics and data handling.

The RS512M32LO4D1BDS-53BT is typically packaged in a small form factor, often a BGA (Ball Grid Array) package. This design allows for efficient thermal management and space-saving on PCBs, making it suitable for high-density applications. Always refer to the manufacturer's datasheet for specific details regarding dimensions and package type.